Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects

Park, Seungbae; Dhakal, Ramji; Gao, Jia

doi:10.1007/s11664-008-0481-9

Cited by 30 publications

(8 citation statements)

References 15 publications

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“…(2005) have developed an anisotropic constitutive model of linear elasticity to study the deformation behaviors of Sn3.8Ag0.7Cu solder under cyclic thermal loading. Park et al. (2008) have done similar studies.…”

Section: Introductionmentioning

confidence: 67%

“…Matin et al (2005) have developed an anisotropic constitutive model of linear elasticity to study the deformation behaviors of Sn3.8Ag0.7Cu solder under cyclic thermal loading. Park et al (2008) have done similar studies. However, these linear anisotropic constitutive models are simple and unrealistic despite being important to understand the anisotropy of Sn-rich solder.…”

Section: Introductionmentioning

confidence: 67%

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Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Zhang

Liu

et al. 2021

International Journal of Damage Mechanics

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With the rapid development of microelectronics and nanoelectronics, Moore law has significantly slowed down and More than Moore based system in packaging (SiP) is expected to be more and more important, at least for next one to two decades. Mechanical behaviors of interconnect materials such as solders are critical for yield in processes and reliability in testing and operation. Based on the framework of crystal plastic theory and continuum damage mechanics, an anisotropic constitutive model coupled with damage was developed to describe the deformation behaviors of Sn-rich solder. In the proposed model, the inelastic shear rate function was presented by hyperbolic sinusoidal form and power law form. For the damage evolution law, the total shear strain was chosen as the damage function variable. The proposed model was implemented into the general finite element software ABAQUS by forward Euler integration procedure. Some simulation examples were performed to verify the proposed model by comparing the simulation results with the experiments at uniaxial tensile conditions with SnAgCuSb solder chosen as the Sn-rich solder. The tensile stress-strain curves of the simulation results agreed well with the experiments at small strain under different temperatures and strain rates. The simulated stress-rupture stages showed reasonable accuracy with the experiments under four representative tensile conditions. Different tensile stress-strain curves of single grains with orientation of (0-0-0)°, (0-45-0)°, and (0-90-0)° were obtained under the same loading conditions, with an inverse relationship between the tensile strength and elongation. This relationship was in accordance with a referable literature. All these results indicate that the proposed model can describe the deformation behaviors of SnAgCuSb solder well under the tensile conditions in consideration of the mechanical anisotropy and the damage evolution.

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Section: Introductionmentioning

confidence: 67%

Section: Introductionmentioning

confidence: 67%

Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Zhang

Liu

et al. 2021

International Journal of Damage Mechanics

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“…At Tier 3, models for crystal plasticity and crystal viscoplasticity and grain boundary sliding require semi-computational techniques [31]. At Tier 4, fully computational methods such as finite element methods are required, to capture actual geometry and boundary conditions of realistic solder joints [32].…”

Section: Estimating Microstructure Evolution With Modelingmentioning

confidence: 99%

Challenges in Future-Generation Interconnects: Microstructure Again

Lee

Bieler

Kim

et al. 2014

Fundamentals of Lead-Free Solder Interconnect Technology

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The aim of this chapter is not to introduce the packaging technology of the future nor the challenges in specific packaging structure. Rather, it is to review the characteristics of technology on the horizon along with the introduction of materials under consideration, briefly consider possible problems associated with such technology, and stress the need for understanding more on the solder itself. For this, this chapter firstly discusses the need for considering new boundary condition of the interconnects that arise from the use of electronics in harsher environment in a small form factor. It is followed by the discussion on the packaging challenges in higher power devices such as the power handling devices and LEDs. Then, material challenges associated with device miniaturization as well as the increased current density in solder interconnects are presented. Finally, the need for and difficulty in developing multiscale model for solder joint property and its behaviors in packaging structure is briefly discussed in order to reemphasize the urgency of achieving more advanced understanding of the Pb-free solder materials in general. Future Packaging and Next-Generation Interconnects: KeywordsThe keywords for future packaging and next-generation interconnects are smaller form factor, higher performance, flexible in form factor and applications, and lower power consumption than the devices used in today's technology. Demand for such devices emerges as electronic devices are increasingly used in unconventional places, and this trend will only increase in the foreseeable future. Such devices will be designed with miniaturization, wider applications, extreme environments, wearable electronics, low power, flexible, more functionality, vertical stacking and 3D architectures, active thermal management, and high current density as design goals and constraints. Critical issues in relation to the development of such devices include the power device package design, MEMS, 3D wafer-level packages, complex

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“…A key objective in CPFEM is to adopt an appropriate constitutive model that can effectively describe the deformation behaviors of the material. To the authors' best knowledge, although some anisotropic mechanical constitutive models have been proposed for Sn‐rich solder, 31–35 no anisotropic thermomechanical constitutive model has been proposed. Based on our previous proposed mechanical constitutive model, 35 a thermomechanical constitutive model was developed in this work.…”

Section: Introductionmentioning

confidence: 99%

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

Zhang

Liu

et al. 2022

Fatigue Fract Eng Mat Struct

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Based on crystal plastic theory, a novel thermomechanical constitutive model was proposed for Sn-rich solder. Material parameters of the proposed constitutive model were determined by fitting the stress-strain curves under uniaxial tensile testings. Combined with the proposed model and the material parameters, crystal plastic finite element method was used to investigate the effects of the microstructure features of grain orientation, grain boundary, and intermetallic compound on the fatigue behaviors of Sn-rich solder joint under the condition of thermal cycle loading. Results showed that the mean absolute percentage error between the simulation and experimental tensile curves was 3.50%, and the three microstructure features affected the fatigue behaviors of Sn-rich solder from different aspects, which were analyzed in detail. Besides, it was concluded that the proposed constitutive model could be effectively used to investigate the fatigue behaviors of Sn-rich solder joint from micro perspective.

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Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects

Cited by 30 publications

References 15 publications

Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Challenges in Future-Generation Interconnects: Microstructure Again

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

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