Three-Dimensional Frequency-Dependent Thermal Model for Planar Transformers in <i>LLC</i> Resonant Converters

Shafaei, Rouhollah; Ordonez, Martin; Saket, Mohammad Ali

doi:10.1109/tpel.2018.2859839

Cited by 43 publications

(13 citation statements)

References 25 publications

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“…FEM is an accurate solution for modelling the heat transfer mechanisms: conduction, convection and radiation. FEM is frequently used to study the thermal behaviour of magnetic components [10, 24, 32, 33]. It solves the same problem as TATPM which is a heat equation associated with convection and radiation represented by heat exchange coefficients.…”

Section: Validation and Discussionmentioning

confidence: 99%

“…Equivalent radiation transfer coefficients can be derived from the Stefan-Boltzmann law given by (23). Then, global coefficients applied to the component external faces are the sum of the resulting coefficients calculated from the two heat transfer modes (24):…”

Section: Boundary Conditionsmentioning

confidence: 99%

“…In [18], a global thermal resistance depending on ambient temperature and power losses is proposed for E/PLT cores. Other models available in the literature are based on more detailed networks [19][20][21][22][23][24]. In [19], a simplified 1D model leads to an RC network that is used to estimate the temperature of the component.…”

Section: Introductionmentioning

confidence: 99%

“…Usually, models proposed in the literature do not often take into account the 3D thermal aspect of planar magnetics, neither different kind of limit conditions especially when they depend on the component's temperature. In [24], the authors have investigated this problem in the case of EE and ER planar cores. The model, based on a lumped parameter thermal network, enables to obtain temperature inside the magnetic cores in transient cases.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Automated tool for 3D planar magnetic temperature modelling: application to EE and E/PLT core‐based components

Bakri

Margueron

Magambo

et al. 2019

IET Power Electronics

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Thermal performance of power converters is a key issue for the power integration. Temperatures inside active and passive devices can be determined using thermal models. Modelling the temperature distribution of high frequency magnetic components is quite complex due to diversity of their geometries and used materials. This paper presents a thermal modelling method based on lumped elements thermal network model, applied to planar magnetic components made of EE and E/PLT cores. The 3D model is automatically generated from the component's geometry. The computation enables to obtain 3D temperature distribution inside windings and core of planar transformers or inductors, in steady state or in transient case. The paper details the proposed modelling method as well as the automated tool including the problem definition and the solving process. The obtained temperature distributions are compared with Finite Element simulation results and measurements on different planar transformers.

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Section: Validation and Discussionmentioning

confidence: 99%

Section: Boundary Conditionsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Automated tool for 3D planar magnetic temperature modelling: application to EE and E/PLT core‐based components

Bakri

Margueron

Magambo

et al. 2019

IET Power Electronics

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show abstract

“…A great challenge for power electronic systems is to remove the heat from the power devices in an efficient and cost-effective manner. Due to the needs of high power density and to the miniaturization of power converters, the components have to operate next to their thermal limits [1]. One of the main concerns in many power converters design procedure is to controlling the heat as the producer's moves toward all-surface-mount implementations.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Power Rectifiers in Steady-State Conditions

Pleşca

Mihet‐Popa

2020

Energies

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Power rectifiers from electrical traction systems, but not only, can be irreversibly damaged if the temperature of the semiconductor junction reaches high values to determine thermal runaway and melting. The paper proposes a mathematical model to calculate the junction and the case temperature in power diodes used in bridge rectifiers, which supplies an inductive-resistive load. The new thermal model may be used to investigate the thermal behavior of the power diodes in steady-state regime for various values of the tightening torque, direct current through the diode, airflow speed and load parameters (resistance and inductance). The obtained computed values were compared with 3D thermal simulation results and experimental tests. The calculated values are aligned with the simulation results and experimental data.

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Optimization of key power loss for LLC circuits with planar transformer in high-frequency and high-power scenarios

Min

Dou

et al. 2021

AIP Advances

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An accurate power loss model, for the design of high-efficiency switching power supplies, is difficult to establish due to the complicated magnetic components where the power loss is hard to calculate. This paper proposed a multi-level power loss model of LLC circuits with a planar transformer of high frequency, high power, and low voltage output. The key loss items can be optimized by using this loss model, the accuracy of which and the feasibility of the optimization method are validated by extensive prototype experiments. The experimental results show that the average accuracy of the loss calculation is about 93.6%, and the high efficiency at high-power conversion (95.9% @ 3 kW, 224–16 V) has been realized using an optimized prototype converter.

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Three-Dimensional Frequency-Dependent Thermal Model for Planar Transformers in LLC Resonant Converters

Cited by 43 publications

References 25 publications

Automated tool for 3D planar magnetic temperature modelling: application to EE and E/PLT core‐based components

Automated tool for 3D planar magnetic temperature modelling: application to EE and E/PLT core‐based components

Thermal Analysis of Power Rectifiers in Steady-State Conditions

Optimization of key power loss for LLC circuits with planar transformer in high-frequency and high-power scenarios

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