2016
DOI: 10.1016/j.commatsci.2015.10.028
|View full text |Cite
|
Sign up to set email alerts
|

Three-dimensional mesoscopic modeling of equiaxed dendritic solidification of a binary alloy

Abstract: The mesoscopic envelope model is a recent multiscale model that is intended to bridge the gap between purely microscopic and macroscopic approaches for the study of dendritic solidification. It consists of the description of a dendritic grain by an envelope that links the active dendrite branches. The envelope growth is deduced from an analytical microscopic model of the dendrite tip growth kinetics matched to the numerical solution of the mesoscopic solute concentration field in the vicinity of the envelope. … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

3
72
0

Year Published

2016
2016
2019
2019

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 40 publications
(75 citation statements)
references
References 36 publications
3
72
0
Order By: Relevance
“…Because of these limitations, several scale-bridging approaches have been proposed to simulate dendritic growth at scales larger than those accessible to phase-field. These models include continuum volumeaveraged approaches [14,15,[37][38][39], models based on dynamics of average dendritic grain envelopes [40,41], and approaches coupling cellular automata with finite elements [42,43], finite differences [44], or Lattice Boltzmann methods [45]. Granular models, with approximate grain shapes based on Voronoi space tessellation, have also been used to study the occurrence of solidification defects resulting from the coupling between grain growth and fluid flow, such as porosities and hot cracking [46,47].…”
Section: Introductionmentioning
confidence: 99%
“…Because of these limitations, several scale-bridging approaches have been proposed to simulate dendritic growth at scales larger than those accessible to phase-field. These models include continuum volumeaveraged approaches [14,15,[37][38][39], models based on dynamics of average dendritic grain envelopes [40,41], and approaches coupling cellular automata with finite elements [42,43], finite differences [44], or Lattice Boltzmann methods [45]. Granular models, with approximate grain shapes based on Voronoi space tessellation, have also been used to study the occurrence of solidification defects resulting from the coupling between grain growth and fluid flow, such as porosities and hot cracking [46,47].…”
Section: Introductionmentioning
confidence: 99%
“…However, few studies have been carried out on the competitive growth among dendrites. Souhar and De Felice et al [32] simulated the mutual influence and competition of multiple 3-D dendrites simultaneously growing in a binary alloy by employing a mesoscopic model for solidification. Compared with PFM, mesoscopic models can readily simulate the mutual influence and competitive growth of 3-D dendrites due to the simplicity of calculation.…”
Section: * LI Fengmentioning
confidence: 99%
“…e.g. Steinbach [2], Souhar et al [3], Alves et al [4] and Takaki et al [5]. The large mechanical deformation description requires finite kinematics, where the overall deformation gradient is decomposed multiplicatively into several intermediate stress-free configurations.…”
Section: Introductionmentioning
confidence: 99%