Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications

Liu, Li; Liu, Ying; Yu, Xiangyang; Du, Jinghong; Zhang, Jiamin; Li, Junpeng; Gan, Guoyou

doi:10.1016/j.polymer.2022.125440

Cited by 18 publications

(12 citation statements)

References 37 publications

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“…Numerous theoretical models have been developed to investigate the thermally conductive composites. , Among them, Foygel et al introduced a specialized thermal conductivity model tailored for high aspect ratio fillers, with a particular focus on the influence of ITR. This model can be expressed by the following equations: λ c − λ m = φ 0 true( V normalf − V normalc 1 − V normalc true) β R ′ = 1 φ 0 L V c β A = false( 2 D 2 / π false) ln true[ 1 − p − 1 + 1 + p − 1 1 + p − 1 − 1 − p − 1...…”

Section: Resultsmentioning

confidence: 99%

“…Moreover, researchers have employed diverse methods, including the ice-template approach, , stress-induced method, , vacuum filtration, , electrospinning, magnetic orientation, and CVD, , to construct a thermally conductive network of hBN within the polymer matrix, resulting in a significant enhancement in the TCs of composites. In our previous study, we developed a hard-template technique using poly(methyl methacrylate) (PMMA) microspheres as sacrificial materials to fabricate isotropic flexible TCP . However, we encountered a challenge in achieving sufficient contact points between hBN layers due to the rigidity of hBN itself, which led to an increase in the ITR f–f .…”

Section: Introductionmentioning

confidence: 99%

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Thermally Conductive, Electrically Insulating Epoxy Pads with Three-Dimensional Polydopamine-Modified and Silver Nanoparticle-Functionalized Hexagonal Boron Nitride Networks

Liu,

Bai,

et al. 2023

ACS Appl. Polym. Mater.

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Electronic components are susceptible to failure due to overheating during operation. Consequently, there is a growing demand for thermally conductive pads (TCPs) that exhibit high thermal conductivity (TC) and electrical insulation properties in electronic packaging. In this study, we synthesized hBN* particles by modifying hexagonal boron nitride (hBN) with polydopamine (PDA). Subsequently, a hybrid thermal conduction filler of hBN*@Ag was prepared by functionalizing silver nanoparticles (AgNPs) on the hBN* surface. Using a hard-template method, a three-dimensional thermally conductive network of hBN*@Ag (3D-hBN*@Ag) is constructed, and epoxy (EP) composites with 3D-hBN*@Ag (3D-hBN*@Ag/EP) are fabricated through the vacuum impregnation method. The results indicate that PDA enhances the interfacial compatibility of hBN-EP and reduces the filler–matrix interfacial thermal resistance (ITRf–m). However, the new interface brought by PDA will increase the filler–filler interfacial thermal resistance (ITRf–f), resulting in no significant improvement of the TC of 3D-hBN*/EP compared to 3D-hBN/EP. The AgNPs sandwiched between hBN layers are essential for enhancing the TCs of 3D-hBN*@Ag/EP composites, which contribute to an increased number of contact points between hBN layers, thereby reducing the ITRf–f. Moreover, a small amount of functionalized AgNPs on hBN will not change the electrical insulation characteristics of the composites. The resulting lightweight 3D-hBN*@Ag 6.0/EP possesses a high TC of 1.381 W m–1 K–1 at 26 wt % filler content. This study presents a strategy for improving the TC limit of composites with 3D filler networks, albeit at the expense of some electrical insulation properties.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermally Conductive, Electrically Insulating Epoxy Pads with Three-Dimensional Polydopamine-Modified and Silver Nanoparticle-Functionalized Hexagonal Boron Nitride Networks

Liu,

Bai,

et al. 2023

ACS Appl. Polym. Mater.

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“…Hard templates are usually used to prepare structures with high resolution. 196 Soft templates are suitable for micro–nano structures that require flexibility and bendability. 197 Composite templates can realize complex micro–nanostructures with greater controllability by tuning the properties and sequences of materials in different layers.…”

Section: Construction Strategiesmentioning

confidence: 99%

Recent advances in the construction and application of stretchable PEDOT smart electronic membranes

Chen,

Ye,

Cang

et al. 2023

J. Mater. Chem. C

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“…), and carbon materials (carbon fiber, carbon nanotubes, graphene, etc. ). − However, achieving the desired λ often requires a large loading of fillers, which negatively impacts the manufacturability and mechanical properties of the PDMS . Although carbon materials, with a high aspect ratio, can endow PDMS composites with decent λ at low filling load, the high electrical conductivity generally limits their applicability in situations where insulation is highly addressed …”

Section: Introductionmentioning

confidence: 99%

Multipurpose Poly(dimethylsiloxane) Dielectric Films with Superb Thermal Conductivity by Incorporating Silver Nanoparticle-Decorated Boron Nitride Nanosheets

et al. 2023

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Thermally conductive dielectric materials hold the potential to revolutionize thermal management. It is highly desirable yet challenging to develop materials with high thermal conductivity (λ), low dielectric loss, and superb flexibility due to the different or even mutually exclusive physical connotations of these properties. This study presents a novel composite film composed of poly(dimethylsiloxane) (PDMS) and silver nanoparticle (AgNP)-decorated with boron nitride nanosheets (BNNS@Ag). In the composite, the uniform and well-dispersed two-dimensional (2D) BNNS are connected by in situ incorporated zero-dimensional (0D) AgNPs, establishing an efficient phonon transport network. The resulting BNNS@Ag/PDMS composite boasts an impressive λ of 3.77 W/m·K, which is approximately 13.6 and 36.6% higher than those of the BNNS/PDMS and h-BN/PDMS composite films, respectively, and nearly four times that of the pure PDMS films. Additionally, the wide band gap of BNNS effectively suppresses electron transport, endowing BNNS@Ag/PDMS with a low dielectric constant (∼4.01, at 103 Hz) and low loss (∼0.003), as well as a high dielectric breakdown strength (124.68 kV/mm). The findings of this study provide a roadmap for designing high-performance PDMS composites to meet the thermal management needs of advanced electronic devices.

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Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications

Cited by 18 publications

References 37 publications

Thermally Conductive, Electrically Insulating Epoxy Pads with Three-Dimensional Polydopamine-Modified and Silver Nanoparticle-Functionalized Hexagonal Boron Nitride Networks

Thermally Conductive, Electrically Insulating Epoxy Pads with Three-Dimensional Polydopamine-Modified and Silver Nanoparticle-Functionalized Hexagonal Boron Nitride Networks

Recent advances in the construction and application of stretchable PEDOT smart electronic membranes

Multipurpose Poly(dimethylsiloxane) Dielectric Films with Superb Thermal Conductivity by Incorporating Silver Nanoparticle-Decorated Boron Nitride Nanosheets

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