Three Dimensional Parametric Analyses of Stress Concentration Factor and Its Mitigation in Isotropic and Orthotropic Plate with Central Circular Hole Under Axial In-Plane Loading

Abstract

The problem of finding the stress concentration factor of a loaded rectangular plate has offered considerably analytical difficulty. The present work focused on understanding of behavior of isotropic and orthotropic plate subjected to static in-plane loading using finite element method. The complete plate model configuration has been analyzed using finite element method based software ANSYS. In the present work two parameters: thickness to width of plate (T/A) and diameter of hole to width of plate (D/A) have been varied for analysis of stress concentration factor (SCF) and its mitigation. Plates of five different materials have been considered for complete analysis to find out the sensitivity of stress concentration factor. The D/A ratio varied from 0.1 to 0.7 for analysis of SCF and varied from 0.1 to 0.5 for analyzing the mitigation of SCF. 0.01, 0.05 and 0.1 are considered as T/A ratio for all the cases. The results are presented in graphical form and discussed. The mitigation in SCF reported is very encouraging. The SCF is more sensitive to D/A ratio as compared to T/A.

Numerical Analysis of Thin Plates with Holes

“…Diany [4] developed stress concentration factors for a plate with holes of different shapes and orientations. Nagpal et al [5] attempted investigations on stress concentration around the holes and notches in both isotropic and orthotropic plates, subjected to in-plane or transverse loading conditions. The effect of presence of cut outs in plates with various shaped cut outs were studied by Watsar et al [6].…”