Three dimensional printing of high dielectric capacitor using projection based stereolithography method

Yang, Yang; Chen, Zeyu; Song, Xuan; Zhu, Benpeng; Hsiai, Tzung K.; Wu, Pei-Chih; Xiong, Rui; Shi, Jing; Chen, Yong; Zhou, Qifa; Shung, K. Kirk

doi:10.1016/j.nanoen.2016.02.045

Cited by 148 publications

(92 citation statements)

References 43 publications

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“…These components include antennas, resistors, coils, capacitors, resonators, and their many variations coupled to physical quantities: pressure, electric and magnetic fields, and mechanical torques and forces. Recently there were several attempts to fabricate these devices into a 3D shape via bond‐wire, liquid metals, printing, special mechanical assembly, and chemical processes to form coils, capacitors, and resonators ( Figure ). However, these techniques suffered from low resolution and complexity, and their sequential nature of fabrication was not conducive to the parallel, mass production of semiconductor devices.…”

Section: Scaling Challenges In Modern Electronic Systemsmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

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Section: Scaling Challenges In Modern Electronic Systemsmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

View full text Add to dashboard Cite

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“…The micro‐3D printing is used in various areas such as photonic‐bandgap materials, tissue‐engineering scaffolds, drug‐delivery devices, microfluidic networks, microsensors, micromachines and bioanalysis . However, most of the micro‐3D printing work are focused on the metal‐ and polymer‐based materials, though there are several jobs on functional ceramics via micro‐3D printing, the details of whose components have not reached micron order and the relative densities are not satisfactory …”

Section: Introductionmentioning

confidence: 99%

3D printing of dense structural ceramic microcomponents with low cost: Tailoring the sintering kinetics and the microstructure evolution

Liu

Tian

et al. 2018

J Am Ceram Soc

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In this study, we have successfully developed a unique 3D printing approach based on mask-image-projection stereolithography (MIP-SL) to fabricate structural ceramics microcomponents with low cost and high efficiency. Ultra-dense submicron crystalline ceramics without fierce grain growth could be obtained via tailoring the sintering kinetics. The ZrO 2 ceramic microcomponents reached the highest relative density (RD) of 99.7% with the average grain size of 0.52 μm upon sintering at 1550°C while the Al 2 O 3 ceramic microcomponents reached its highest RD of 98.31% with the average grain size of 2.6 μm upon sintering at 1600°C.Oxide ceramics microcomponents of fully flexible design can be produced easily without visible defects via the method developed in this study, which demonstrates significant potential in the applications of microelectromechanical systems, micro-optical electronics systems and micro-opto-electro-mechanical systems. The method developed in this study has addressed the problem successfully by healing the interlayer interface defects in densification process via the sintering kinetic window and microstructure evolution. The current work provides a promising opportunity to fabricate structural ceramic microcomponents with complex shape, high precision, and high surface smoothness. K E Y W O R D S

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“…In order to build mechanically compliant and multifunctional biomimetic devices, new materials and fabrication methods are constantly being developed to address the challenges . Among them, 3D printing has noticeable advantages on fabricating complex geometry and integrating multiple materials . The section will review some recent 3D‐printing developments for realizing efficient electronic devices to sense and generate biomimetic signals.…”

Section: D Printing Of Bioinspired Electrical Devicesmentioning

confidence: 99%

Recent Progress in Biomimetic Additive Manufacturing Technology: From Materials to Functional Structures

et al. 2018

Self Cite

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Nature has developed high-performance materials and structures over millions of years of evolution and provides valuable sources of inspiration for the design of next-generation structural materials, given the variety of excellent mechanical, hydrodynamic, optical, and electrical properties. Biomimicry, by learning from nature's concepts and design principles, is driving a paradigm shift in modern materials science and technology. However, the complicated structural architectures in nature far exceed the capability of traditional design and fabrication technologies, which hinders the progress of biomimetic study and its usage in engineering systems. Additive manufacturing (three-dimensional (3D) printing) has created new opportunities for manipulating and mimicking the intrinsically multiscale, multimaterial, and multifunctional structures in nature. Here, an overview of recent developments in 3D printing of biomimetic reinforced mechanics, shape changing, and hydrodynamic structures, as well as optical and electrical devices is provided. The inspirations are from various creatures such as nacre, lobster claw, pine cone, flowers, octopus, butterfly wing, fly eye, etc., and various 3D-printing technologies are discussed. Future opportunities for the development of biomimetic 3D-printing technology to fabricate next-generation functional materials and structures in mechanical, electrical, optical, and biomedical engineering are also outlined.

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Three dimensional printing of high dielectric capacitor using projection based stereolithography method

Cited by 148 publications

References 43 publications

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

3D printing of dense structural ceramic microcomponents with low cost: Tailoring the sintering kinetics and the microstructure evolution

Recent Progress in Biomimetic Additive Manufacturing Technology: From Materials to Functional Structures

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