Micro-electro-mechanical system (MEMS) devices integrate various mechanical elements, sensors, actuators, and electronics on a single silicon substrate in order to accomplish a multitude of different tasks in a diverse range of fields. The potential for device miniaturization made possible by MEMS micro-fabrication techniques has facilitated the development of many new applications, such as highly compact, non-invasive pressure sensors, accelerometers, gas sensors, etc. Besides their small physical footprint, such devices possess many other advantages compared to their macro-scale counterparts, including greater precision, lower power consumption, more rapid response, and the potential for low-cost batch production. One area in which MEMS technology has attracted particular attention is that of flow measurement. Broadly speaking, existing micro-flow sensors can be categorized as either thermal or non-thermal, depending upon their mode of operation. This paper commences by providing a high level overview of the MEMS field and then describes some of the fundamental thermal and nonthermal micro-flow sensors presented in the literature over the past 30 years or so.Keywords Cantilever type flow sensor Á Differential pressure flow sensor Á Lift force flow sensor Á Micro-electro-mechanical systems Á Resonating flow sensor Á Thermal flow sensor
Origin and applications of MEMS technologyThe concept of micro-electro-mechanical systems (MEMS) dates back to the early 1960s, but only became an achievable reality when the tools and techniques originally developed for integrated circuit (IC) manufacturing became sufficiently advanced. Whereas electronic semiconductor devices are fabricated using IC process sequences, MEMS devices are produced by selectively etching away parts of the underlying silicon wafer or adding and patterning additional metallic and polymer layers to form the required mechanical and electromechanical devices. Typical MEMs micro-fabrication techniques include deposition [e.g. electroplating, sputtering, chemical vapor deposition (CVD), etc.], photolithography, and etching (e.g. wet etching, reactive ion etching (RIE), etc.]. Although still an emerging technology, MEMS devices are being increasingly deployed for mainstream commercial and industrial applications such as pressure sensors, accelerometers, gas sensors, RF switches, micro-mirrors, etc. (Löfdahl and Gadel-Hak 1999). In addition to the obvious advantages accruing from their diminutive scale (including a greater portability, a more discrete implementation and a reduced power consumption), MEMS devices permit the bulk