Three-dimensional simulation of single-lap and bridge joints of coated conductor under tension and bending tests

Peng, Xubin; Yong, Huadong; Zhou, Youhe

doi:10.1016/j.compstruct.2021.115146

Cited by 10 publications

(3 citation statements)

References 59 publications

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“…It is shown that the performance of solder joints is significantly different from that of single tapes, both in terms of mechanical and electromechanical properties. Additionally, various simulations have been performed for the analysis of strain and stress distributions of joint components under mechanical loads [ 28 , 35 , 37 , 38 , 39 ]. Huang et al [ 28 ] and Konstantopoulou et al [ 37 ] used FEM to simulate the distribution of the stress in the spliced joint samples under axial loading; furthermore, Peng et al [ 39 , 40 ] analyzed the interface cracking and stress distribution characteristics of joints under mechanical deformation based on a cohesive zone model.…”

Section: Introductionmentioning

confidence: 99%

“…Additionally, various simulations have been performed for the analysis of strain and stress distributions of joint components under mechanical loads [ 28 , 35 , 37 , 38 , 39 ]. Huang et al [ 28 ] and Konstantopoulou et al [ 37 ] used FEM to simulate the distribution of the stress in the spliced joint samples under axial loading; furthermore, Peng et al [ 39 , 40 ] analyzed the interface cracking and stress distribution characteristics of joints under mechanical deformation based on a cohesive zone model. However, the available numerical studies can only provide the strain and stress distribution of each component in a solder joint, but the intrinsic mechanisms of the mechanical behavior and electromechanical properties of the joints have rarely been studied.…”

Section: Introductionmentioning

confidence: 99%

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Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Liao,

Wang,

Chen

et al. 2024

Materials

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As the second-generation high-temperature superconducting conductors, rare earth–barium–copper–oxide (REBCO) coated conductor (CC) tapes have good potential as high-field and high-energy superconductors. In superconducting applications, several joints are required for conjugating comparatively short REBCO CC tapes. Soldering lap joints are the simplest and most commonly applied REBCO CC joints. In addition to joint resistance, the mechanical behavior and electromechanical properties are also crucial for superconducting applications. In this paper, the electromechanical properties and mechanical behaviors of soldering lap joints at 77 K under a self-field were studied. The mechanical behavior was addressed by using a full three-dimensional multilayer elastic–plastic finite element model (FEM) with REBCO CC tape main layers and solder connecting layers. Then, the electromechanical properties were analyzed by using Gao’s strain-Ic degradation general model on the basis of the FEM results. Both the mechanical behavior and electromechanical properties were verified by experimental results. The effects of soldering lap conditions including lap length, soldering thickness and lap style on the electromechanical properties and mechanical behaviors were discussed. The results indicate that shorter overlap lengths and a thinner solder can reduce the premature degradation of Ic due to stress concentrations nearby the joint edges; moreover, the irreversible critical strain is significantly higher in the back-to-back joint approach compared to the widely used face-to-face joint approach.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Liao,

Wang,

Chen

et al. 2024

Materials

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“…Recently, Su et al reported that the soldered voltage tap could cause stress cumulation during in-situ tensile testing [20]. Peng et al reported stress cumulation at the edge of the solder welding joint [21]. This suggests that the I c irreversible degradation stress might be underestimated owing to the presence of the soldered voltage tap.…”

Section: Introductionmentioning

confidence: 99%

Novel two-step procedure for measuring I _c vs. tensile stress of commercial REBCO tape

Zhang,

Chen,

Wang

et al. 2023

Supercond. Sci. Technol.

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This paper presents a novel two-step procedure for measuring the critical current (Ic) properties as a function of tensile stress. The proposed method completely eliminates the possible negative effect of the voltage tap used during the tensile procedure, allowing the actual Ic irreversible degradation stress to be clearly determined. Six different commercial REBCO tapes from five manufacturers were tested. The Ic value does not degrade until the stress reaches the “inflection area” in the tensile curve, which corresponds to the most pronounced transformation step from elastic to plastic deformation. This allows easy estimation of the stress corresponding to Ic irreversible degradation by a simple and accurate cryogenic tensile curve instead of complicated in-situ Ic tensile measurement. A feasible composite-material tensile model is established to explain the phenomenon. In addition, fatigue measurements on a commercial REBCO tape from Shanghai Superconductor technology show that the tape can withstand 10,000 cycles under 580 MPa and over 5,000 cycles under 695 MPa, which also is consistent with the proposed composite-materials tensile model and is confirmed by the EBSD experiments on the Hastelloy substrate. This research provides better insight and tools for designing and fabricating extremely high-field magnets.

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Numerical simulation of the mechanical behavior of superconducting tape in conductor on round core cable using the cohesive zone model

Tang,

Peng,

Yong

2023

Appl. Math. Mech.-Engl. Ed.

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Three-dimensional simulation of single-lap and bridge joints of coated conductor under tension and bending tests

Cited by 10 publications

References 59 publications

Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Novel two-step procedure for measuring I _c vs. tensile stress of commercial REBCO tape

Numerical simulation of the mechanical behavior of superconducting tape in conductor on round core cable using the cohesive zone model

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Three-dimensional simulation of single-lap and bridge joints of coated conductor under tension and bending tests

Cited by 10 publications

References 59 publications

Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Novel two-step procedure for measuring I c vs. tensile stress of commercial REBCO tape

Numerical simulation of the mechanical behavior of superconducting tape in conductor on round core cable using the cohesive zone model

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Product

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About

Novel two-step procedure for measuring I _c vs. tensile stress of commercial REBCO tape