2012
DOI: 10.1109/led.2011.2182601
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Three-Dimensional Solenoids Realized via High-Density Deep Coil Stacking for MEMS Application

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Cited by 8 publications
(5 citation statements)
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“…Power, wireless Through-silicon windings, double-sided embedded windings 161 , stacked substrate 162 , magnetic core integration.…”
Section: Tsv Fabrication Processesmentioning
confidence: 99%
“…Power, wireless Through-silicon windings, double-sided embedded windings 161 , stacked substrate 162 , magnetic core integration.…”
Section: Tsv Fabrication Processesmentioning
confidence: 99%
“…In order to maximize the component of the magnetic field used for transduction, the array was placed near the edge of the magnet, and the microcantilevers in the array were aligned such that the fixed end of the beams were parallel to the magnet's edge. While this magnet and experimental setup facilitated experiments in a laboratory setting, portable applications would require either integrating magnetic material [42][43][44][45][46][47] or a solenoid [48][49][50][51]. Both methods have distinct advantages and pitfalls, but these relatively recent citations demonstrate that progress is being made and that it may be Figure 10.…”
Section: Device Silicon Bulk Siliconmentioning
confidence: 99%
“…Electrically controlled generation of strong magnetic induction at room temperature is a topic of broad interest in a wide range of science and engineering applications, including magnetic resonance imaging, DNA analyses, biological behavior, and power electronics, among others (1)(2)(3)(4)(5). Many such magnetic induction systems use designs following Faraday's law to exploit similar strategies for realizing large coil densities, integrating high-permeability material, and maximizing current handling ability (6)(7)(8)(9)(10)(11)(12). Although a variety of technique innovations are capable of realizing specific structures in certain classes of materials on the macroscale so as to attain the desired performance, micro-and nanoscale fabrication techniques relying on advanced nanotechnologies have the potential to provide an extremely promising platform to embrace the trend of high-level integration (8)(9)(10)(11)(12).…”
Section: Introductionmentioning
confidence: 99%
“…Although a variety of technique innovations are capable of realizing specific structures in certain classes of materials on the macroscale so as to attain the desired performance, micro-and nanoscale fabrication techniques relying on advanced nanotechnologies have the potential to provide an extremely promising platform to embrace the trend of high-level integration (8)(9)(10)(11)(12). The applicability of these latter methods, however, currently only extends directly to structures and materials compatible with two-dimensional (2D) semiconductor processing or 2.5D microelectromechanical systems (MEMS) technology, which is naturally contrary to the optimum design principle of 3D magnetic induction system on the macroscale (6,7). Fabrication of 3D coil structures monolithically based on semiconductor processingcompatible methods can be challenging.…”
Section: Introductionmentioning
confidence: 99%