Through Glass Via (TGV) disc loaded monopole antennas for millimeter-wave wireless interposer communication

Hwangbo, Seahee; Rahimi, Arian; Kim, Cheolbok; Yang, Hyunseok; Yoon, Yong-Kyu

doi:10.1109/ectc.2015.7159717

Cited by 11 publications

(4 citation statements)

References 13 publications

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“…Two sets of data are shown: one for the Tx-Rx distance of 10 mm and another for 20 mm. The resonant frequencies, return loss, and insertion loss of the TSV_A are compared against all current WNoC antenna solutions in the literature: (i) the zig-zag antenna [26], (ii) the glass interposer antenna (TGV) [22,23,27], (iii) the monopole antenna [14], (iv) the planar log-periodic [18] antenna, and (v) meander [21] antenna. It is shown that TSV_A at both distances has an insertion loss of −3 dB, which is orders of magnitude smaller than all other on-chip antennas surveyed.…”

Section: Proposed Ic Tsv Antenna (Ic Tsv_a)mentioning

confidence: 99%

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TSV‐based antenna for on‐chip wireless communication

Pano

Tekin

Liu

et al. 2020

IET Microwaves, Antennas & Propagation

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On‐chip wireless interconnects provide signal broadcasting and link shortcuts for improved latency and throughput, useful considering the increase of the number of processing elements on a chip. In this work, a through‐silicon via antenna (TSV_A) for on‐chip wireless communication is proposed. TSV_A significantly improves the wireless interconnect performance over current solutions of on‐chip antennas, which occupy a large area of the chip and are not capable of far‐reaching transmission. Printed circuit board (PCB) prototypes are designed and fabricated to validate the proposed TSV_A. The PCB prototype of the TSV_A has an insertion loss of 5–10 dB at a distance of ≃20 mm, measured in PCB and validated with high fidelity 3D finite element method simulation results. TSV_A has improved path loss, smaller size, and lower manufacturing costs due to the well‐established TSV fabrication process for 3D‐ICs. Projections for an on‐chip 3D‐IC operation indicate up to 40 dB improved signal strength compared to other on‐chip antennas, with an insertion loss of ≃3–5 dB up to a 30 mm distance.

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Section: Proposed Ic Tsv Antenna (Ic Tsv_a)mentioning

confidence: 99%

“…The optional top and ground planes are introduced for even further improved signal integrity, and manufactured using common post-IC-manufacturing processes. Antennas with glass substrate propagation for 3D-ICs are proposed in [22,23]. HFSS simulations show a carrier frequency between 70 and 90 GHz, with a bandwidth of ≃10 GHz.…”

Section: Introductionmentioning

confidence: 99%

TSV‐based antenna for on‐chip wireless communication

Pano

Tekin

Liu

et al. 2020

IET Microwaves, Antennas & Propagation

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“…However, silicon interposers with TSV technologies have challenges such as the fabrication cost, process complexity and high electrical substrate losses. Recently, glass interposers with through-glass vias (TGVs) have been extensively studied [15]- [18] because of their excellent electrical properties as low substrate losses at high frequency, CTE adjustability, fine line spacing, availability of large and ultra-thin panels, low material and manufacturing cost [19]. Based on these merits, glass interposers are the best alternative for conventional silicon interposers and an attractive platform for high frequency, radio frequency (RF), microwave passive components and packaging [20]- [22].…”

Section: Introductionmentioning

confidence: 99%

V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology

et al. 2019

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In this paper, we demonstrate a V-band planar micromachined helical antenna (PHA) with end-fire radiation on the glass substrate. The planar rectangular helical configuration is realized using the novel through-glass silicon via (TGSV) technology. The proposed micromachined antenna is designed and fabricated on a borosilicate glass substrate of thickness 350 µm, which has a very low-dielectric loss compared to silicon at millimeter-wave bands. The proposed PHA is fed by a microstrip line, and the planar helical configuration with 3.25 turns with a truncated ground plane is designed for achieving wideband end-fire radiation with seven tungsten-coated silicon vias and six connected gold arm patterns, which are fabricated using the TGSV technology. The electrical length of the proposed antenna is (3 λ o ×1.4 λ o). The designed antenna operates at the center frequency of 58 GHz. A prototype of the proposed antenna is fabricated by micromachining technology and tested. The simulated and measured results show that the proposed antenna has a wide operational bandwidth of 50.3 to 65 GHz for |S 11 | < −10 dB with a fractional bandwidth (FBW) of 25.5%. The measured peak gain is 6.3 dBi, and measured efficiency is 62% at the center frequency of 58 GHz. All measurements are in close agreement with simulated results. The proposed planar helical antenna with end-fire radiation is useful for applications in traveling-wave-tubes operating in millimeter-wave and higher frequencies, millimeter-wave on-board wireless communication, radar imaging, and tracking applications. INDEX TERMS Borosilicate-glass, end-fire, planar helical antenna, through glass silicon via (TGSV), travelling-wave-tubes (TWTs).

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“…Glass interposers with through-glass vias (TGVs) have been widely studied [4], [6], [33]- [35], due to their excellent electrical properties, such as low substrate losses at high frequency, CTE adjustability, fine line spacing, availability of large and ultra-thin panels, and low material and manufacturing cost [5], [31], [33]. Thus, glass interposers are the current best option to replace conventional silicon interposers and provide an attractive platform for high frequency, RF, microwave passive components and packaging.…”

mentioning

confidence: 99%

Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

et al. 2020

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This paper presents a W-band planar type via-monopole based quasi Yagi-Uda antenna using metal coated through glass silicon via structures. The antenna was designed and fabricated on 350 µm thick borosilicate glass substrate, which has very low dielectric loss compared with silicon at millimeterwave frequencies. We used a microstrip line to feed the antenna, and the Yagi-Uda configuration using via structured radiator; reflectors; and director were fabricated using tungsten coated silicon via structures embedded in reflowed glass substrate with good high frequency characteristics. The proposed antenna achieved vertical polarization in planar configuration with height 0.09λo. High gain with end-fire radiation was achieved due to the Yagi-Uda configuration. Measured results confirmed the fabricated antenna operated in the W-band with 10 dB fractional bandwidth (FBW) of 12.5% from 76.3 to 86.5 GHz and peak gain of 7.82 dBi at 81 GHz in the end-fire direction. Thus, the proposed antenna with end-fire radiation will be useful for millimeter-wave onboard wireless communication, radar imaging, and tracking applications. INDEX TERMS Borosilicate-glass, end-fire, Yagi-Uda antenna, through glass silicon via (TGSV). I. INTRODUCTION With the ongoing development of modern communication systems, there has been growing demand for high Gbps data rates [1]; since bandwidth is directly proportional to communication data rates [2]. Therefore, radio frequency (RF) front ends operating at frequencies above 70 GHz or higher have attracted considerable research attention [3], [4]. High atmospheric absorption at these frequencies make them suitable for high speed short range communication, requiring antennas with high gain for W-band applications, such as high resolution radar imaging, remote sensing and high speed wireless communication [5], [6]. Signal-to-interference-plusnoise ratio (SINR) generally decreases at high frequencies due to extreme free space loss. Therefore, suitable antennas are critical to meet challenging requirements. Highly directional antennas and line-of-sight (LOS) communication can The associate editor coordinating the review of this manuscript and approving it for publication was Yuan Yao .

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Through Glass Via (TGV) disc loaded monopole antennas for millimeter-wave wireless interposer communication

Cited by 11 publications

References 13 publications

TSV‐based antenna for on‐chip wireless communication

TSV‐based antenna for on‐chip wireless communication

V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology

Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

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