2014
DOI: 10.1039/c4ra09586c
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Through-holes, cavities and perforations in polydimethylsiloxane (PDMS) chips

Abstract: We present a method to fabricate through-holes between 10 to 180 μm between polydimethylsiloxane (PDMS) layers of microfluidic large-scale integration platforms.

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Cited by 12 publications
(8 citation statements)
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“…The ratio of 6.5:1:2.5 used in the previous study resulted in a tendency of the substrate to break easily after curing. 17 This disadvantage shows the weak point of the micropattern formation, which occurs subsequent to stretching. Therefore, we chose a ratio of 20:1:1.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…The ratio of 6.5:1:2.5 used in the previous study resulted in a tendency of the substrate to break easily after curing. 17 This disadvantage shows the weak point of the micropattern formation, which occurs subsequent to stretching. Therefore, we chose a ratio of 20:1:1.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…The microchamber had a length of 32 mm, a width of 27 mm, and a height of 1 mm. A thin PDMS membrane was fabricated by the spin coating method. , Briefly, the PDMS prepolymer was poured onto a poly­(tetrafluoroethylene) (PTFE) plate and rotated at a speed of 1200 rpm for 35 s using a spin coater (KW-4A, Xinyou, China). After curing it on a hot plate at 120 °C for 20 min, a PDMS membrane with a thickness of ∼50 μm was formed.…”
Section: Methodsmentioning
confidence: 99%
“…The mold for the control circuit was manufactured with SU-8 3025 Photoresist, and all channels had a rectangular profile and a height of 20 μm. Molds were coated with C 4 F 8 following published protocols (51). Sylgard 184 (Dow Corning) was used to replicate PDMS chips from the molds with a process described before (52).…”
Section: Methodsmentioning
confidence: 99%