Through-pellicle defect repair for advanced photomasks

Robinson, Tod; White, Roy; Bozak, Ron; LeClaire, Jeff; Archuletta, Mike; Lee, David

doi:10.1117/12.865197

Cited by 1 publication

(1 citation statement)

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“…3 This was surprising since it was assumed that since the fast vector process usually means less exposure time of the laser spot to the mask surface, it would instead be less aggressive than the spot process. It is now believed that the more active motion of the beam over the surface may more aggressively move or remove soft defects in these low beam power process regimes.…”

Section: Introductionmentioning

confidence: 97%

Advanced laser mask repair in the current wafer foundry environment

Robinson¹,

Yi²,

LeClaire³

et al. 2010

SPIE Proceedings

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Contrary to the prior assumptions of its technical demise, deep UV (DUV) femtosecond pulsed laser repair of photomasks is continuing to mature and improve as a technology. Similar to the optical enhancements that allow for 193 nm wavelength light to continue being used down to the 32, or even in some cases 22 nm, node, the process regimes for this type of laser repair continue to expand as new processes are discovered. This work reviews the qualification of repair performance for production at a major wafer foundry site. In addition advances are shown in the area of through-pellicle repair (TRP) process development. These advances include the preferential (versus surrounding reference mask structures) removal of soft defects and the capability to remove or manipulate particles on top of a flat absorber region with no detectable removal of the absorber. These developments will further demonstrate the progressive decoupling of the laser repair spot size from the minimum technology node for laser repair.

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Section: Introductionmentioning

confidence: 97%