Time-Dependence of Epoxy Debonding

Adolf, Douglas Brian; Stavig, Mark E.; Kawaguchi, Stacie; Chambers, Robert S.

doi:10.1080/00218460601102886

Cited by 5 publications

(4 citation statements)

References 8 publications

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“…Additional studies of DGEBA/DEA have been published sporadically. These include investigations of the gelation process [22][23][24][25], of the coefficient of thermal expansion [13], of mechanical properties [26][27][28][29][30][31][32][33][34][35][36], and of copolymers based on the DGEBA/DEA system [37].…”

Section: Introductionmentioning

confidence: 99%

Cure mechanisms of diglycidyl ether of bisphenol A (DGEBA) epoxy with diethanolamine

McCoy

Ancipink

Clarkson

et al. 2016

Polymer

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When diethanolamine (DEA) is used as a curative for a DGEBA epoxy, a rapid "adduct-forming" reaction of epoxide with the secondary amine of DEA is followed by a slow "gelation" reaction of epoxide with hydroxyl and with other epoxide. Through an extensive review of previous investigations of simpler, but chemically similar, reactions, it is deduced that at low temperature the DGEBA/DEA gelation reaction is "activated" (shows a pronounced induction time, similar to autocatalytic behavior) by the tertiary amine in the adduct. At high temperature, the activated nature of the reaction disappears.The impact of this mechanism change on the kinetics of the gelation reaction, as resolved with differential scanning calorimetry, infrared spectroscopy, and isothermal microcalorimetry, is presented. It is shown that the kinetic characteristics of the gelationreaction of the DGEBA/DEA system are similar to other tertiary-amine activated epoxy reactions and consistent with the anionic polymerization model previously proposed for this class of materials. Principle results are the time-temperature-transformation diagram, the effective activation energy, and the upper stability temperature of the zwitterion

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Section: Introductionmentioning

confidence: 99%

Cure mechanisms of diglycidyl ether of bisphenol A (DGEBA) epoxy with diethanolamine

McCoy

Ancipink

Clarkson

et al. 2016

Polymer

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“…In previous studies [2,3], there appeared to be little dependence of the monotonically loaded, shear stress at failure on resin, filler, or substrate (Figs. 2 and 3).…”

Section: Methodsmentioning

confidence: 90%

Predicting the Initiation of Thermoset De-Bonding

Adolf

Chambers

Hance

et al. 2010

The Journal of Adhesion

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Napkin ring adhesion tests over a broad range of experimental conditions suggested a de-bonding mechanism for glassy thermosets associated with ''runaway'' nonlinear viscoelasticity. Finite element analyses of these tests using a high fidelity, nonlinear constitutive equation were used to identify a single, scalar metric that consistently predicted the initiation of de-bonding, a critical value of the maximum principal strain in the ''interphase'' zone. In principle, such a de-bonding metric enables evaluation of design margins in practical components.

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“…Several sensitivity studies of the napkin ring adhesive strength were performed previously. 7 Of particular interest here, the adhesive strength of the 828 epoxy reacted with a mixture of two amines (an aliphatic amine, Jeffamine D230, Huntsman, at 16.7 phr, and an cycloaliphatic amine, Ancamine 2049, Air Products Allentown, at 16.7 phr) was measured with alumina fillers. The volume fraction of alumina was varied from 43 to 48vol%, which is quite high, and two different types of alumina were investigated (a tabular alumina, T64, Alcoa, and a spherical alumina, AA18, Sumitomo).…”

Section: Adhesive Failure In Epoxy Encapsulantsmentioning

confidence: 99%

“…7: Filler exponents from Eq. 2.10 used for the nonlinear viscoelastic model inputs of an epoxy filled with hard particulates.…”

mentioning

confidence: 99%

Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

Neilsen

Austin²,

Adolf³

et al. 2011

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Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analyses of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.

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Time-Dependence of Epoxy Debonding

Cited by 5 publications

References 8 publications

Cure mechanisms of diglycidyl ether of bisphenol A (DGEBA) epoxy with diethanolamine

Cure mechanisms of diglycidyl ether of bisphenol A (DGEBA) epoxy with diethanolamine

Predicting the Initiation of Thermoset De-Bonding

Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

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