2016
DOI: 10.1016/j.electacta.2016.02.167
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Time Evolution of Stress and Microstructure in Electroplated Copper Films

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Cited by 13 publications
(1 citation statement)
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“…A typical standard is the tensile testing under ISO 105-E03:2010 [150], which permits quantification of the tendency of hard thin top layers to cracking and delamination. Specifically, tensile tests and biaxial stress measurements are extremely important to assess adhesion failures on aluminum and electrodeposited copper alloys [151,152]. Research on the mechanical behavior of nanolaminated composites and alloys is a relatively new field, and the development of interfacial adhesion models to predict experimental observations is still challenging [153].…”
Section: Surface Inspection and Mechanical Propertiesmentioning
confidence: 99%
“…A typical standard is the tensile testing under ISO 105-E03:2010 [150], which permits quantification of the tendency of hard thin top layers to cracking and delamination. Specifically, tensile tests and biaxial stress measurements are extremely important to assess adhesion failures on aluminum and electrodeposited copper alloys [151,152]. Research on the mechanical behavior of nanolaminated composites and alloys is a relatively new field, and the development of interfacial adhesion models to predict experimental observations is still challenging [153].…”
Section: Surface Inspection and Mechanical Propertiesmentioning
confidence: 99%