Time‐Resolved Diagnostics of Dual High Power Impulse Magnetron Sputtering With Pulse Delays of 15 µs and 500 µs

Straňák, Vítězslav; Drache, Steffen; Čada, Martin; Hubička, Zdeněk; Tichý, M.; Hippler, R.

doi:10.1002/ctpp.201000065

Cited by 30 publications

(22 citation statements)

References 31 publications

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“…As mentioned in Section 2, the substrates were electrically floating during deposition. Thus, ionized species are accelerated to the substrate by the floating potential which has values of approximately -10 V [38,39], i.e. ionized species (Ar + and Ag + ) impinging on the substrate have energies above 10 eV, which are significantly larger than those of sputtered atoms (~2 eV).…”

Section: Discussionmentioning

confidence: 99%

Time-domain and energetic bombardment effects on the nucleation and coalescence of thin metal films on amorphous substrates

Magnfält¹,

Elofsson²,

Abadias³

et al. 2013

J. Phys. D: Appl. Phys.

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Section: Discussionmentioning

confidence: 99%

Time-domain and energetic bombardment effects on the nucleation and coalescence of thin metal films on amorphous substrates

Magnfält¹,

Elofsson²,

Abadias³

et al. 2013

J. Phys. D: Appl. Phys.

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“…Stranak et al 158 performed time resolved Langmuir probe measurements in a dual HiPIMS system with two cathodes in a closed magnetic field configuration. They explored the effect of a delay between the subsequent pulses and demonstrate that the delay can be applied as an additional control parameter to adjust the process parameters.…”

Section: à3mentioning

confidence: 99%

High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

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The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma based sputtering technology. In HiPIMS, high power is applied to the magnetron target in unipolar pulses at low duty cycle and low repetition frequency while keeping the average power about 2 orders of magnitude lower than the peak power. This results in a high plasma density, and high ionization fraction of the sputtered vapor, which allows better control of the film growth by controlling the energy and direction of the deposition species. This is a significant advantage over conventional dc magnetron sputtering where the sputtered vapor consists mainly of neutral species. The HiPIMS discharge is now an established ionized physical vapor deposition technique, which is easily scalable and has been successfully introduced into various industrial applications. The authors give an overview of the development of the HiPIMS discharge, and the underlying mechanisms that dictate the discharge properties. First, an introduction to the magnetron sputtering discharge and its various configurations and modifications is given. Then the development and properties of the high power pulsed power supply are discussed, followed by an overview of the measured plasma parameters in the HiPIMS discharge, the electron energy and density, the ion energy, ion flux and plasma composition, and a discussion on the deposition rate. Finally, some of the models that have been developed to gain understanding of the discharge processes are reviewed, including the phenomenological material pathway model, and the ionization region model.

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“…Magnetrons are often used in dual-magnetron configuration [320][321][322] to address the "disappearing anode" problem in reactive deposition; the principle has been extended to HiPIMS [323][324][325]. To increase the HiPIMS deposition rate, a HiPIMS-rf hybrid scheme can be employed [326].…”

Section: Deposition In Vacuummentioning

confidence: 99%

A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS)

Anders

2014

Surface and Coatings Technology

242

109

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High power impulse magnetron sputtering (HiPIMS) has been in the center of attention over the last years as it is an emerging physical vapor deposition (PVD) technology that combines advantages of magnetron sputtering with various forms of energetic deposition of films such as ion plating and cathodic arc plasma deposition. It should not come at a surprise that many extension and variations of HiPIMS make use, intentionally or unintentionally, of previously discovered approaches to film processing such as substrate surface preparation by metal ion sputtering and phased biasing for film texture and stress control. Therefore, in this review, an overview is given on some historical developments and features of cathodic arc and HiPIMS plasmas, showing commonalities and differences. To limit the scope, emphasis is put on plasma properties, as opposed to surveying the vast literature on specific film materials and their properties.

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Time‐Resolved Diagnostics of Dual High Power Impulse Magnetron Sputtering With Pulse Delays of 15 µs and 500 µs

Cited by 30 publications

References 31 publications

Time-domain and energetic bombardment effects on the nucleation and coalescence of thin metal films on amorphous substrates

Time-domain and energetic bombardment effects on the nucleation and coalescence of thin metal films on amorphous substrates

High power impulse magnetron sputtering discharge

A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS)

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