2016
DOI: 10.1016/j.apsusc.2015.10.230
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Time-resolved photoluminescence for evaluating laser-induced damage during dielectric stack ablation in silicon solar cells

Abstract: Selective laser ablation of dielectric layers on crystalline silicon wafers was investigated for solar cell fabrication. Laser processing was performed on Al2O3, and bi-layers Al2O3/SiNX:H with a nanosecond UV laser at various energy densities ranging from 0.4 to 2 J.cm-2. Ablation threshold was correlated to the simulated temperature at the interface between the dielectric coatings and the silicon substrate. Laser-induced damage to the silicon substrate was evaluated by time-resolved photoluminescence. The mi… Show more

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Cited by 6 publications
(4 citation statements)
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“…In contrast, in the case of the traditional laser opening process, the Al 2 O 3 and SiN x layers have very small absorption of laser energy, so the strategy for creating holes is that the Si wafer absorbs heat energy, which would then be transferred by conduction in a few nanoseconds to the adjacent layers [ 9 , 10 , 11 ]. The ablation of the passivation layer initiates when the temperature reached in the layers is of the order of the boiling temperature (around 3525 K for Al 2 O 3 and 2150 K for SiN x ) [ 12 ]. The required laser energy is about 0.8 J/cm 2 , which is close to the energy (typically around 1 J/cm 2 ) that can melt or damage Si wafers [ 12 ].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…In contrast, in the case of the traditional laser opening process, the Al 2 O 3 and SiN x layers have very small absorption of laser energy, so the strategy for creating holes is that the Si wafer absorbs heat energy, which would then be transferred by conduction in a few nanoseconds to the adjacent layers [ 9 , 10 , 11 ]. The ablation of the passivation layer initiates when the temperature reached in the layers is of the order of the boiling temperature (around 3525 K for Al 2 O 3 and 2150 K for SiN x ) [ 12 ]. The required laser energy is about 0.8 J/cm 2 , which is close to the energy (typically around 1 J/cm 2 ) that can melt or damage Si wafers [ 12 ].…”
Section: Resultsmentioning
confidence: 99%
“…The ablation of the passivation layer initiates when the temperature reached in the layers is of the order of the boiling temperature (around 3525 K for Al 2 O 3 and 2150 K for SiN x ) [ 12 ]. The required laser energy is about 0.8 J/cm 2 , which is close to the energy (typically around 1 J/cm 2 ) that can melt or damage Si wafers [ 12 ]. It is noted that there might be some kind of carbon trace remaining on the surface wafer, and this would possibly affect metal contact formation.…”
Section: Resultsmentioning
confidence: 99%
“…Some research groups have employed lasers to reactivate inactive dopants subsequent to heavy thermal diffusion, improving the overall result of the diffusion [14]. However, laserinduced damage can reduce the solar cell performance and thus the in uence of the laser process has to be investigated carefully [15]. Bulk lifetime of laser processed samples can help to quantify such damage.…”
Section: Introductionmentioning
confidence: 99%
“…In this study, we correlate luminescence spreading under partial illumination with carrier kinetics measured by time‐resolved microwave photoconductance decay (μPCD). While μPCD and time‐resolved photoluminescence (trPL) are popular methods for direct measurement of carrier kinetics in photovoltaic materials, both techniques are most often designed to measure lifetimes within an area photoexcited by the laser pulse without explicit consideration of carrier drift away from the photoexcitation into the nonilluminated cell regions. As we further discuss in this study, the transients measured on fully fabricated device structures with conductive layers, such as an emitter or electrodes, are likely affected by factors, such as the cell's resistance, capacitance, and area.…”
mentioning
confidence: 99%