Tin and Tin Alloys for Lead‐Free Solder

Codeposition mechanism in Sn/Ag nanoparticle composite plating

“…The Sn-Ag alloy plating has been used as the solderable coatings in the electronic packaging industry for a decade since Sn-Ag-Cu alloys were the standard Pb-free solder materials [17,18]. Table 1 shows the optimum bath composition and the operating conditions of the Sn/Ag-nanoparticle composite plating that have been used in industry.…”

Corrosion reliability of lead-free solder systems used in electronics

“…Therefore, from July of 2006, the regulation of inhibiting the usage of hazardous substances in the electrical and electronic equipment (RoHS) directive restricted the utility of lead in new electronic equipment [1]. Katsuaki [2] and Yun [3] reported that the SAC alloy family is the prominent lead-free alternative based on the result of DICTRA simulation and its eutectic microstructure. A number of composition based on SAC has been tried for various properties regarding to melting temperature, thermal/electrical conductivity, expansion coefficient and compatibility to applied flux system etc.…”

“…A number of composition based on SAC has been tried for various properties regarding to melting temperature, thermal/electrical conductivity, expansion coefficient and compatibility to applied flux system etc. [3]. Bismuth, copper and silver has been reported to form eutectic intermetallic compounds (IMCs) with tin at approximate 139 ºC, 227 ºC and 221ºC respectively [3].…”

“…[3]. Bismuth, copper and silver has been reported to form eutectic intermetallic compounds (IMCs) with tin at approximate 139 ºC, 227 ºC and 221ºC respectively [3]. Ho et al [4] reported nickel and copper presented (Cu 1-x Ni x ) 6 Sn 5 phase when the concentration of Cu is 0.6-3.0 wt%.…”

“…While in a recent study [5], it has been reported that Innolot has the best anti-fatigue performance due to the attribution of Bi and Sb to the formation of Ag 3 Sn IMC. A number of investigations in the literature deals with microstructure and mechanical properties of SAC solder alloys [3], [5][6][7][8][9], however only few studies have been reported on corrosion reliability aspects and the role of solder alloys microstructure. Most of the reported investigations were focused on potentiodynamic polarization test [10][11][12].…”