Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths

Baylis, B. K. W.; Hedgecock, N. E.; Schlesinger, M.

doi:10.1149/1.2133303

Cited by 19 publications

(14 citation statements)

References 6 publications

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“…There are a number of techniques that use electroless deposition for applying metal patterns onto polymeric substrates (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11). Sharp (1), Chow et al (5), Schlesinger et al (6,7), and Baylis et al (8)(9)(10)(11) examined methods by which the electroless catalysts were photochemically activated (9) or deactivated (5). Their work led to examinations (12) of the effect of oxidized substrates on the activity of electroless catalysts.…”

mentioning

confidence: 99%

Interactions of Electroless Catalysts with Plasma‐Oxidized Surfaces of Polystyrene‐Based Resins

Mance

Waldo

Dow

1989

J. Electrochem. Soc.

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The way in which chemically modified polymer surfaces (substrates) affect the activity of electroless catalysts was examined. Surfaces of three injection-molded styrene containing polymers [polystyrene (PS), poly(styrene-acrylonitrile) (SAN), and poly(acrylonitrile-butadiene-styrene) (ABS)] were modified by either plasma oxidation or by plasma oxidation followed by immersion in sodium hydroxide solution. After modification, two palladium catalyst systems (a two-step palladium catalyst and a commercial colloid catalyst) and six electroless baths were tested for activity in combinations with these surfaces. The activities ofthe two catalysts vary unpredictably and differently as the polymer, surface treatment, and electroless bath are changed. X-ray photoelectron spectroscopy results show only a weak correlation between surface composition and platability: (i) plasma-treated polymers show a net increase in surface oxygen, present mostly as carbonyl, (ii) immersing the plasma-exposed surfaces in alkaline solutions lowers oxygen and carbonyl concentrations. Some of these results differ from those previously obtained with photo-oxidized surfaces.

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confidence: 99%

Interactions of Electroless Catalysts with Plasma‐Oxidized Surfaces of Polystyrene‐Based Resins

Mance

Waldo

Dow

1989

J. Electrochem. Soc.

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“…The activator usually contains salts of noble metals, PdC12, PtCl~, or AgNO~, that can be reduced in the pattern areas by the reducing species Red. Specifically, for the positive process (1, 3, 6, 7) using Sn 2+ as the sensitizer, the activation process is described by the equation 1 Sn 2+ -5 Pd 2+ --> Pd -5 Sn 4+ [12] and for the negative sensitizing process (2) using Fe s+ as a sensitizer, by the equation 2Fe 2+ + Pd 2+ ----> Pd + 2Fe 3+ [13] Ions present in the background areas, Sn 4+ in the positive process and Fe 3+ in the negative process, are inactive in the activator solution. However, Sn 4+, under certain conditions, can be chemically active in the activator solution (4,(8)(9)(10)(11)(12)(13).…”

Section: Photoelectrochemical Methodsmentioning

confidence: 99%

Photochemical Selective Activation for Electroless Metal Deposition on Nonconductors

Paunović¹

1980

J. Electrochem. Soc.

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The photochemical methods for selective activation of nonconductors for electroless metal deposition have been classified in this review on the basis of kinetic scheme involved. There are three general kinetic schemes for the formation of catalytic metallic nuclei on nonconductors: photoelectrochemical, photoelectron, and intramolecular photoreduction. Photoelectrochemical scheme involves a photochemical reaction which is followed by an electrochemical reaction. The photochemical reaction is used to produce or deactivate the reducing agent. Catalytic metallic nuclei are formed in the subsequent electrochemical reaction. In the photoelectron method, electrons necessary for the formation of catalytic metallic nuclei M from metallic cations M+n are generated in the direct absorption process of a photon by a semiconductor crystal, which results in the generation of an electron and a hole. In the intramolecular photoreduction kinetic scheme catalytic metallic nuclei are formed in the intramolecular ligand to metal electron transfer process. This review surveys fundamental photochemical principles and discusses problems and prospects of the above processes.

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“…For more details, the reader should consult [17][18][19], as well as the relevant chapters in this volume. The preparatory steps for electroless deposition are discussed in some detail in Section 15.4.…”

Section: Metalization Of Plasticsmentioning

confidence: 99%

Deposition on Nonconductors

Schlesinger

2010

Modern Electroplating

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At about the same time that electroplating of silver was first being practiced (circa 1840), plating on nonconductors was developed for the purpose of electroforming and for making copper-engraving plates. Nearly a century ago the art entered into its artistic phase, producing metallic artistic elements on glass, wood, and the like. The one surviving remnant of this phase is the gold-or copper-plated baby shoe. Earlier in this century the art was put to use in the service of more practical applications. Those include graphic arts, toys, buttons, records, and the like.In most of these applications a number of stages in the plating process were required. Typically the first of these was a roughening process. That was done mostly mechanically and sometimes chemically. As an example of the former we mention sandblasting, while as an example of the latter etching of glass with hydrofluoric acid comes to mind. The second stage is that of sealing, if required, such as in the case of wooden objects. The third and most important stage is the application of the conductive layer which then will make eventual electroplating possible. Here a number of methods were available to the plater:. Bronzing Metallic powder mixed in varnish is applied with a brush. A silver immersion dip coating, to improve conductivity, follows. . Graphiting Graphite powder with or without a lacquer binder is applied with a brush. . Metallic Painting Fused metallic paint, silver base, is dispersed in a flux, applied, and subsequently fired to above 500 C . Metallizing Metallic coating is directly produced by electrochemical (other than electroless) methods such as a SnCl 2 immersion followed by immersion in a silvering bath (consisting of silver nitrate and ammonium hydroxide). That bath is not autocatalytic.The next stage was electroplating. Since the initial conductivity is, as a rule, marginal, a copper strike solution was used to deposit the first 8-12 mm and a standard electroplating solution for the rest. (A typical strike solution was made of 75 g L À1 CuSO 4 ÁH 2 O as well as 2 mL L À1 H 2 SO 4 , resulting in a solution pH value of 2-2.5.) The final stage was that of polishing the finished product for appearance. Care had to be exercised not to overheat and thus damage the coating during polishing. RECENT DEVELOPMENTSIn the corresponding chapter by E. B. Saubestre in the third edition of Modern Electroplating, 1960 is stated as the watershed year. The reason is the number of important developments that took place then and changed the practice of plating on nonconductors from an art to a practical science along the following lines:1. Plateable Plastics It became evident to resin (particularly ABS, a terpolymer of acrylonitrile, butadiene, and styrene) producers that the composition of the copolymer and the molding conditions could be adapted to facilitate the subsequent exposure to electrolytes used in the preparation of surfaces for electroplating. 2. Chemical Conditioners It was found that variants of older etchants for plastics could be used...

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Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths

Cited by 19 publications

References 6 publications

Interactions of Electroless Catalysts with Plasma‐Oxidized Surfaces of Polystyrene‐Based Resins

Interactions of Electroless Catalysts with Plasma‐Oxidized Surfaces of Polystyrene‐Based Resins

Photochemical Selective Activation for Electroless Metal Deposition on Nonconductors

Deposition on Nonconductors

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