Tin Whiskers

Vicenzo, Antonello

doi:10.1007/978-0-85729-236-0_6

Cited by 3 publications

(1 citation statement)

References 67 publications

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“…Tin whiskers study on tin surface finish has been reported by many researchers [1][2][3][4] since it became major concern towards optimizing the use of lead-free tin alloys in electronic industry. Pure tin became the right choice after the banning of using lead, a toxic material in electronic components because it has good conductive [5], good wettability [2], and low cost [6] materials. Tin whiskers can be described as monocrsytalline metal protruding from tin surface finish which grow spontaneously and may cause short circuit when it touch each other [7].…”

Section: Introductionmentioning

confidence: 99%

Effect of the Formation of CuO Flowers and SnO<sub>2</sub> on the Growth of Tin Whiskers on Immersion Tin Surface Finish

Fadil

Yusof²,

Ourdjini³

et al. 2014

AMM

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The effect of the formation of CuO flowers and SnO2on tin whiskers formation and growth in 30°C/60%RH environmental condition for tin surface finish had been studied. Immersion plating method was used to coat a layer of tin onto a copper, Cu substrates. The coated surface was subjected to external stress by micro hardness indenter with 2N load in order to simulate an external stress in coating layer and to promote the formation of tin whiskers. FESEM and EDX was used to study the type and chemical composition of whiskers and oxides formed. Image analyser was used to measure the whiskers length using JEDEC Standard No 22-A121A. After 1 week of the exposure under 30°C/60%RH environmental condition, kinked-type whiskers were formed and the whiskers growth were discontinued at week 4 due to the distruction at the end-tip of kinked-type tin whisker to grow further when it touched the coating surface. An obervation until 52 weeks of exposure time found that the formation and growth of CuO flowers and the oxidation of non-kinked-type of tin whiskers to form SnO2promoted by external stress also contributed to the discontinuity of whiskers growth.

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Section: Introductionmentioning

confidence: 99%

Effect of the Formation of CuO Flowers and SnO<sub>2</sub> on the Growth of Tin Whiskers on Immersion Tin Surface Finish

Fadil

Yusof²,

Ourdjini³

et al. 2014

AMM

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Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under External Stresses by Bending

Amin

Yusof

Kahar

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Accelerated Testing and Reliability of FDM-Based Structural Electronics

Wałpuski

Słoma

2022

Applied Sciences

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With the development of the miniaturization of electronic systems, heat dissipation from components has become an increasing challenge. Structural electronics represent a new approach to this problem. Instead of downsizing all the elements, in this idea, electronic parts of the device are embedded into its mechanical construction. This approach has many advantages, but the reliability of systems constructed this way has not been extensively studied so far. In this work, circuits consisting of silver ink conductive traces were printed on FDM polymer substrates, with or without 0 Ω resistors, and were subjected to accelerated aging testing. The samples were divided into three groups, and for each of them, the mean time to failure was calculated, which for the best group was 8000 h. This paper also presents the mechanism that led to the failure of these systems, as well as actions that will lead to the elimination of this phenomenon.

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Tin Whiskers

Cited by 3 publications

References 67 publications

Effect of the Formation of CuO Flowers and SnO<sub>2</sub> on the Growth of Tin Whiskers on Immersion Tin Surface Finish

Effect of the Formation of CuO Flowers and SnO<sub>2</sub> on the Growth of Tin Whiskers on Immersion Tin Surface Finish

Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under External Stresses by Bending

Accelerated Testing and Reliability of FDM-Based Structural Electronics

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