Tiny (0.72 mm&lt;sup&gt;2&lt;/sup&gt;) pressure sensor integrating MEMS and CMOS LSI with back-end-of-line MEMS platform

Fujimori, Takahiro; Takano, Hideaki; Machida, Shinjiro; Goto, Yasushi

doi:10.1109/sensor.2009.5285695

Cited by 5 publications

(2 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The hand is mounted on a linear slider that allows it to move vertically. A fingertip module (incorporating an optical slip sensor ADNS-5050 from Avago Technologies, three MEMS pressure sensors [9], and the SDP chip) was also developed. One module is mounted on each fingertip of the robotic hand.…”

Section: Implementation Of Prototype Systemmentioning

confidence: 99%

Scalable robotic-hand control system based on a hierarchical multi-processor architecture adopting a large number of tactile sensors

Ito

Saen

Osada

2012

2012 IEEE/RSJ International Conference on Intelligent Robots and Systems

View full text Add to dashboard Cite

A robotic-hand controller with operating performance scalable according to the number of connected tactile sensors was developed. To eliminate performance bottlenecks that appear with increasing number of sensors, the controller architecture adopts multiple processors connected in a looselycoupled hierarchical structure. Moreover, to maximize operation throughput of the system, a technique for gathering sensor data while all components operate asynchronously was also developed. A prototype robotic-hand system based on this architecture was constructed. The system experimentally demonstrated 62%-reduced control latency and 6.5-times faster sensor-data processing, thus achieving seven times greater performance scalability as compared with a conventional controller architecture. As a result, the proposed architecture enables the robotic-hand system to grasp objects with different weights and hardnesses.

show abstract

Section: Implementation Of Prototype Systemmentioning

confidence: 99%

Scalable robotic-hand control system based on a hierarchical multi-processor architecture adopting a large number of tactile sensors

Ito

Saen

Osada

2012

2012 IEEE/RSJ International Conference on Intelligent Robots and Systems

View full text Add to dashboard Cite

show abstract

“…CMOS MEMS pressure sensors that have been implemented using available foundry processes have been reported in [7][8][9]. Existing CMOS MEMS pressure sensors mainly consist of a flexible diaphragm with an embedded deformable sensing electrode and a fixed reference sensing electrode.…”

Section: Introductionmentioning

confidence: 99%

Development of a CMOS MEMS pressure sensor with a mechanical force-displacement transduction structure

Cheng

Chang

et al. 2015

J. Micromech. Microeng.

View full text Add to dashboard Cite

This study presents a capacitive pressure sensor with a mechanical force-displacement transduction structure based on the commercially available standard CMOS process (the TSMC 0.18 μm 1P6M CMOS process). The pressure sensor has a deformable diaphragm to support a movable plate with an embedded sensing electrode. As the diaphragm is deformed by the ambient pressure, the movable plate and its embedded sensing electrode are displaced. Thus, the pressure is detected from the capacitance change between the movable and fixed electrodes. The undeformed movable electrode will increase the effective sensing area between the sensing electrodes, thereby improving the sensitivity. Experimental results show that the proposed pressure sensor with a force-displacement transducer will increase the sensitivity by 126% within the 20 kPa–300 kPa absolute pressure range. Moreover, this study extends the design to add pillars inside the pressure sensor to further increase its sensing area as well as sensitivity. A sensitivity improvement of 117% is also demonstrated for a pressure sensor with an enlarged sensing electrode (the overlap area is increased two fold).

show abstract

MEMS technology using back-end of line processes in CMOS LSI

Machida

2010

2010 IEEE International Interconnect Technology Conference

View full text Add to dashboard Cite

Tiny (0.72 mm<sup>2</sup>) pressure sensor integrating MEMS and CMOS LSI with back-end-of-line MEMS platform

Cited by 5 publications

References 5 publications

Scalable robotic-hand control system based on a hierarchical multi-processor architecture adopting a large number of tactile sensors

Scalable robotic-hand control system based on a hierarchical multi-processor architecture adopting a large number of tactile sensors

Development of a CMOS MEMS pressure sensor with a mechanical force-displacement transduction structure

MEMS technology using back-end of line processes in CMOS LSI

Contact Info

Product

Resources

About