“…Conventional thin film deposition methods such as chemical vapour deposition (CVD), physical vapour deposition (PVD) or sputtering are not suitable, as the deposited material cannot reach the deepest part of the TiO 2 nanotube layers, and effective utilization of the tube interiors is disabled due to tube mouth clogging. Other attempts, using spin-coating, 19 , 20 electrodeposition, 21 , 22 and chemical bath deposition, 23 , 24 were reported to infiltrate secondary materials in the inner surface of the nanotubes, however complete infiltration of secondary materials was unfortunately constrained to a reduced number of materials.…”