2021 Symposium on Design, Test, Integration &Amp; Packaging of MEMS and MOEMS (DTIP) 2021
DOI: 10.1109/dtip54218.2021.9568501
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Titanium isotropic and anisotropic etching for MEMS applications

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Cited by 1 publication
(2 citation statements)
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“…[21] Ettouri et al have presented the technology of surface modification of titanium through a fluorine-based reactive ion etching (RIE) process, where the bulk Ti was etched in an inductively coupled plasma using a mixture of SF 6 , O 2 , and Ar. [22] Depending on the process parameters (e.g., self-bias voltage, gas flow rates), the authors obtained various etch rates and titanium trenches of different width. The obtained results indicate that trenches of varying profiles can be formed by balancing the fluorine radical-assisted isotropic etching, the O 2 passivation film, and the physical Ar ions bombardment.…”
Section: Introductionmentioning
confidence: 99%
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“…[21] Ettouri et al have presented the technology of surface modification of titanium through a fluorine-based reactive ion etching (RIE) process, where the bulk Ti was etched in an inductively coupled plasma using a mixture of SF 6 , O 2 , and Ar. [22] Depending on the process parameters (e.g., self-bias voltage, gas flow rates), the authors obtained various etch rates and titanium trenches of different width. The obtained results indicate that trenches of varying profiles can be formed by balancing the fluorine radical-assisted isotropic etching, the O 2 passivation film, and the physical Ar ions bombardment.…”
Section: Introductionmentioning
confidence: 99%
“…The following examples should be listed here: titanium and its alloys, titanium nitride, yttrium fluoride film, silicone rubber. [ 22–26 ] However, all published studies do not exhaust the issue and do not reveal the potential of this modification method.…”
Section: Introductionmentioning
confidence: 99%