Titanium metastable phases in sputtered Ti-Fe films and their influence in the electrical resistivity

We have investigated the influence of the granular microstructure in the electrical resistivity of RF-sputtered Ti100−xCox thin films. Their x-rays characterization has been correlated with dc resistivity measurements from 7 to 300 K. A minimum in the resistivity, ρ(T), centered around Tm∼50 K, was recorded for Ti93Co7 samples grown at 30 W. Contrarily, samples grown at 110 W and the same x value displayed no evidences of that low-temperature anomaly. This phenomenon correlated with the change of the majority Ti granular phase: hcp-Ti for the sample grown at 30 W and bcc-Ti for the 110 W sample. That minimum arises from the great difference in Co solubility into both Ti granular phases (0.8 at. % in hcp-Ti and 14.5 at. % in bcc-Ti). Hence, the very small quantity of Co diluted into the hcp-Ti grains allows us to consider Co particles as uncorrelated magnetic impurities which scatter the conduction electrons. This magnetic Kondo scattering would be the mechanism responsible for the observed minimum in the resistivity of Ti93Co7 samples grown at 30 W.

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Titanium metal quantum-dot composite induced by subplantation

Zhao

Huang

Jacobson

et al. 2003

Applied Physics Letters

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Electronic excitation and optical responses of metal-nanoparticle composites under heavy-ion implantation Synthesis and characterization of metal-dielectric composites with copper nanoparticles embedded in a glass matrix: A multitechnique approach J. Appl. Phys. 98, 054301 (2005); 10.1063/1.2011776 Organized two-dimensional Ti-SiO 2 metal quantum dot composites induced by subplantation J. Appl. Phys. 95, 5768 (2004); 10.1063/1.1691483 Synthesis and characterization of size-controlled vanadium dioxide nanocrystals in a fused silica matrix

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Titanium metastable phases in sputtered Ti-Fe films and their influence in the electrical resistivity

Cited by 5 publications

References 21 publications

Microstructure evolution of TiAl matrix in the process of magnetron sputtering and hot isostatic pressing for fabricating TiAl/SiCf composites

Microstructure evolution of TiAl matrix in the process of magnetron sputtering and hot isostatic pressing for fabricating TiAl/SiCf composites

Magnetic Kondo scattering in the electrical resistivity of sputtered Ti–Co films

Titanium metal quantum-dot composite induced by subplantation

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