2004
DOI: 10.1016/j.jmatprotec.2003.09.001
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Titanium nitride coatings on copper alloy prepared by dc reactive magnetron sputtering

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Cited by 16 publications
(7 citation statements)
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“…The first deposited layer on the substrate was Ti with the last being TiN in order to improve the adhesion [21]. The change over from Ti to TiN deposition was achieved by controlling the nitrogen flow without interruption of the deposition so that a graded interface was generalized.…”
Section: Methodsmentioning
confidence: 99%
“…The first deposited layer on the substrate was Ti with the last being TiN in order to improve the adhesion [21]. The change over from Ti to TiN deposition was achieved by controlling the nitrogen flow without interruption of the deposition so that a graded interface was generalized.…”
Section: Methodsmentioning
confidence: 99%
“…3 -7 There are many processes for deposition of titanium nitride on the alloys. They are chemical vapour deposition, 7,8 plasma-enhanced chemical vapour deposition, 9,10 magnetron sputtering, 11,12 ion implantation 13,14 and plasma deposition. 15 These processes are somewhat expensive owing to the requirement of high vacuum systems.…”
Section: Introductionmentioning
confidence: 99%
“…An overall higher number of O vacancies in both anatase and rutile thin films are generated as compared to Ti vacancies which is likely due to lower displacement energies of O atoms as compared to Ti atoms. The vacancy generation indicates that the displaced O atoms form vacancyinterstitial pair and they can bond to other displaced O atoms in the lattice as well as to the implanted N atom [9]. The latter will result in the mixing of N 2p and O 2p states which gives rise to the enhanced photocatalytic activity as well as reduction in the band gap of TiO2 thin films [6,10].…”
Section: Fig 2: a Correlation Between The Energy Loss By Implanted Nmentioning
confidence: 99%