2007
DOI: 10.1016/j.apsusc.2006.12.004
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Titanium oxynitride thin films sputter deposited by the reactive gas pulsing process

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Cited by 106 publications
(53 citation statements)
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“…For N 2 PPs sufficient to introduce significant nitrogen into the films, N/O stoichiometry varies nonlinearly as a function of the ratio of N 2 and O 2 gas flow rates, highlighting the importance of careful control and calibration of the reaction gas atmosphere. 20,21,[25][26][27][28][29] Using a variable leak valve to control O 2 PP, we demonstrate the ability to carefully control O 2 PPs and fine-tune oxynitride chemistries. We further discuss a heuristic approach to rapidly obtain the optimal O 2 PP for depositing oxynitride films.…”
Section: Introductionmentioning
confidence: 99%
“…For N 2 PPs sufficient to introduce significant nitrogen into the films, N/O stoichiometry varies nonlinearly as a function of the ratio of N 2 and O 2 gas flow rates, highlighting the importance of careful control and calibration of the reaction gas atmosphere. 20,21,[25][26][27][28][29] Using a variable leak valve to control O 2 PP, we demonstrate the ability to carefully control O 2 PPs and fine-tune oxynitride chemistries. We further discuss a heuristic approach to rapidly obtain the optimal O 2 PP for depositing oxynitride films.…”
Section: Introductionmentioning
confidence: 99%
“…Dc magnetron sputtering was successfully combined with reactive gas pulsing process to get crystalline TiO x N y without thermal annealing [29][30][31]. With the same purpose Herman et al employed dc pulsed dual magnetron working with repetition frequency 100 kHz and duty cycle 50 % [34].…”
Section: Introductionmentioning
confidence: 99%
“…Various deposition techniques, e.g. pulsed laser deposition (PLD) [15][16][17], sol-gel methods [18][19][20], ion-assisted electron beam evaporation [21,22], magnetron sputtering [10,[23][24][25][26][27][28][29][30][31][32][33][34] have been employed to prepare TiO x N y thin films. Owing to its numerous advantages, magnetron sputtering deposition is a well established method for coating which has been already extended to the industry.…”
Section: Introductionmentioning
confidence: 99%
“…The distance between the target and the substrate was fixed at 65 mm. The gas flow rates were controlled by a homemade system [21]. All depositions were carried out with an argon flow rate of 2 sccm and a constant pumping speed of 10 L s -1 , which produced an argon partial pressure of 0.28 Pa.…”
Section: Methodsmentioning
confidence: 99%
“…This kind of material has attracted huge attention in recent years due to its potential applications as high refractive index materials in multilayered interference filters [4], as anti-reflecting coatings for solar cells [5], as optical waveguides [6] and as capacitor dielectric in high density dynamic random access memories (DRAMs) [7][8][9]. Compared to silicon dioxide, which has a dielectric constant of 3.9, stoichiometric tantalum oxide Ta 2 O 5 compounds can provide about 5 to 6 times increase in the capacitance density (dielectric constant of Ta 2 O 5 is [20][21][22][23][24][25][26][27]). This could lead to a high packing density in the next generations of DRAMs without reducing the thickness of the dielectric materials to unachievable values.…”
Section: Introductionmentioning
confidence: 99%