To reduce the passivation layer of Cu substrate by the ultrasonic assisted electrochemical potential activation method

Abstract

In the micro electro mechanical system (MEMS) area, micro metal devices fabricating by the electroplating process were used widely in biology, medicine and optics field. However, due to the oxide layer of the metal substrate surface, the electroplating layer suffers from the poor adhesion. In order to reduce the oxide layer of the metal substrate surface, effects of the ultrasonic assisted electrochemical potential activation method have been investigated originally. The electrochemical test was processed by an electrochemical station. The oxide content of the substrate surface was measured by the X-ray photoelectron spectroscopy (XPS) method. The experimental results show that, comparing with the ultrasound free one, the ultrasonic assisted electrochemical potential activation method can improve the hydrogen evolution reaction and reduce the metal ion nucleation rate. Then the Cu substrate surface oxide content has been restored. Results of this paper can provide a new ultrasonic electrochemical potential activation method to activate the oxide layer of the substrate surface, as well as to improve the adhesion.

Solving the Bonding Problem of the Ni Thin Coating with the Ultrasonic Assisted Electrochemical Potential Activation Method

“…This phenomenon may be caused by the ultrasonic fluid micro jet and the ultrasonic cavitation. The effects of the ultrasonic activation reaction mainly include two aspects [ 25 ]. Firstly, the region between the Ni ions deposited potential and the hydrogen evolution potential can be enlarged by the ultrasonic activation.…”