Toolset for measuring thermal behavior of FPGA devices

Weber, Pawel; Zagrabski, Maciej; Wojciechowski, Bartosz; Berezowski, Krzysztof S.; Nikodem, Maciej; Kȩpa, Krzysztof

doi:10.1109/therminic.2013.6675251

Cited by 9 publications

(7 citation statements)

References 16 publications

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“…Size of the CCB is designdependent, however with the control block limited to 175 CLBs (2% of the reconfigurable resources) it is possible to control up to 20 heater blocks and up to 126 temperature sensors while reading core voltage and temperature as reported by the SystemMonitor [11]. The sensors were previously calibrated for Spartan-3 and Spartan-6 devices using a temperature-controlled chamber [12]. However, with newer technology in the Virtex 5 sensors had to be calibrated anew.…”

Section: Resultsmentioning

confidence: 99%

Hardware microprocessor thermal emulation using synthetic heat sources and temperature sensors in FPGA

Wojciechowski

Nikodem

Weber

et al. 2014

20th International Workshop on Thermal Investigations of ICs and Systems

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Section: Resultsmentioning

confidence: 99%

Hardware microprocessor thermal emulation using synthetic heat sources and temperature sensors in FPGA

Wojciechowski

Nikodem

Weber

et al. 2014

20th International Workshop on Thermal Investigations of ICs and Systems

Self Cite

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“…The ring oscillator is continuously oscillating as long as the enable input is on. In this work, the ring oscillator uses the enable input switch [32, 48, 49, 53] instead of the reset input [50, 54], since the reset input causes the FPGA to reboot the entire system. If the enable switch is used as the input, the entire system is not affected as long as the digital temperature sensor is under an off condition.…”

Section: Methodsmentioning

confidence: 99%

Delay performance due to thermal variation on field‐programmable gate array via the adoption of a stable ring oscillator

Jaafar

Soin²,

Hatta³

et al. 2019

IET Computers & Digital Techniques

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Thermal issues are rapidly evolving in the field-programmable gate arrays (FPGAs) and are being intensely studied as these issues appear to significantly affect the delay performance of FGPAs. A ring oscillator has been widely used as a digital temperature sensor to sense this thermal effect on FPGAs. The delay generated by the ring oscillator will vary depending on the temperature environment due to negative bias temperature instability, hot carrier injection and electromigration. It is therefore critical to adopt an accurate ring oscillator design to effectively measure the delay in FGPAs. In this study, a digital temperature sensor with a stable ring oscillator is proposed. Measurement periods of 512 and 4096 clock cycles have been implemented and the relationship between temperature, delay and total count has been established. The results show that as the temperature increases to 100°C, the delay decreases by 3.99 and 33.98% for 512 and 4096 clock cycles, respectively. It has been found that in order to reduce the degradation effect on the Virtex-6 FPGA, adopting a measurement period of 512 clock cycles is the best method. The measured data is successfully validated through a set of simulations. Thus, it may benefit a system designer and industrial player, especially in designing temperature-based FPGAs.

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“…As the Zynq is in a 28 nm technology and past experiments were led in 40 nm(Xilinx Virtex 5/6) [8,10] or in 90 nm(Altera Cyclone II), this difference may be ascribed to the technology. To study this hypothesis and the behavior of the ARO sensor on an old technology, the design was ported on a Xilinx Virtex-5 (chip XC5VFX30T on an Avnet board aes-v5fxt-evl30-g).…”

Section: Calibrationmentioning

confidence: 99%

“…The number of available contributions [1][2][3][4]6,[8][9][10] makes digital thermal sensors for FPGAs a hot topic. The main advantage over integrated analog sensor has been identified as the possibility of reconfiguration.…”

Section: Introductionmentioning

confidence: 99%

Implementation of a fast relative digital temperature sensor to achieve thermal protection in Zynq SoC technology

Lefebvre

Montero

Rubio

2017

Microelectronics Reliability

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More and more industrial embedded systems are developed to undergo hard environmental conditions, especially high temperatures. To prevent this impact, environmental conditions (e.g. the temperature) could be monitored. Plenty of new industrial designs are built around SoCs, and more especially around the Zynq-7000 introduced by Xilinx in 2011. In fact, monitoring the temperature inside the Zynq has become a challenge. While many applications focused on precision, the application proposed here instead is in an industrial context and aims at detecting a temperature excess as fast as possible to achieve the thermal protection of a logic area of the chip. Most of the digital sensors designed require a calibration to be operational. Such a process is not viable for time to market, and a solution must be found to either lighten it (e.g. by doing a simple 3-points calibration) or simply avoiding it. Instead of measuring the temperature in an absolute way, this paper focuses on detecting if the temperature is above or below a threshold. This work exhibits the implementation of three temperature digital sensors with promising results on Zynq technology. Two of the presented sensors are based on a ring-oscillator and another uses a flip-flop as a sensing element. Results show that a temperature increase can be detected in less than 1ms without any calibration protocol and this sensor was found to perfectly fit the targeted application.

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Toolset for measuring thermal behavior of FPGA devices

Cited by 9 publications

References 16 publications

Hardware microprocessor thermal emulation using synthetic heat sources and temperature sensors in FPGA

Hardware microprocessor thermal emulation using synthetic heat sources and temperature sensors in FPGA

Delay performance due to thermal variation on field‐programmable gate array via the adoption of a stable ring oscillator

Implementation of a fast relative digital temperature sensor to achieve thermal protection in Zynq SoC technology

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