2012
DOI: 10.1016/j.cap.2011.06.006
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Top-gate amorphous IGZO thin-film transistors with a SiO buffer layer inserted between active channel layer and gate insulator

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Cited by 21 publications
(7 citation statements)
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“…Fig. 4 show the evolution of the transfer curves as a function of the NBIS time for devices A, 7 B, C and D, respectively. As seen in Fig.…”
Section: Resultsmentioning
confidence: 98%
See 1 more Smart Citation
“…Fig. 4 show the evolution of the transfer curves as a function of the NBIS time for devices A, 7 B, C and D, respectively. As seen in Fig.…”
Section: Resultsmentioning
confidence: 98%
“…In particular, metal oxide semiconductor thin films with wide energy bandgap materials such as ZnO, InGaZnO and InZnO (IZO) enable the transparent electronic or display to be realized. So far, although researchers have conducted a lot of research to improve performances of thin film transistors [3][4][5][6][7] , there are still some issues need to be resolved. Such as how to control the threshold voltage for circuit design and power consumption, the mechanism of device instability and how to improve the stability under various stresses for example, bias, illumination and temperature.…”
Section: Introductionmentioning
confidence: 97%
“…Among them we find vacuum sublimation of organic (small-molecule) semiconductors, and RFmagnetron sputter coating of metal-oxide semiconductors. Inorganic gate dielectrics are also frequently deposited by vacuum deposition methods, such as PECVD [93], [94], sputter coating [95], [96] and atomic layer deposition (ALD) [97]. These techniques generally afford greater control of composition and microstructure than solution-based methods.…”
Section: Vacuum-based Versus Solution-based Methodsmentioning
confidence: 99%
“…PECVD and other above-mentioned techniques have common limitations of higher equipment cost and/or longer processing duration as compared with thermal evaporation. Furthermore, in commonly used PECVD and sputtering techniques, plasma damage or shallow ion implantation may occur during the device fabrication process, which could have detrimental effects on the electrical characteristics of GaN HEMTs [24,25]. Due to the simple technique and being free of ion damage, thermally evaporated SiO has been used in many devices such as In-Ga-Zn-O thin-film transistors [24], self-switching diodes [26] and graphene field-effect transistors [27].…”
Section: Introductionmentioning
confidence: 99%