Topography of the Surface and Subsurface Layers of Grinding Balls Operating in Dry and Wet Grinding Modes

Stalinskii, D. V.; Rudyuk, A. S.; Solenyi, V. K.

doi:10.3103/s0967091221020091

Cited by 2 publications

(1 citation statement)

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“…In a traditional grinding process, the machining dimension of the parts and the 3D model of the machined surface are obtained by instrument detection after grinding [1][2][3]. If the processing parameters are selected improperly, the parts will not meet the technical requirements, which will result in wasting money and resources [4].…”

Section: Introductionmentioning

confidence: 99%

A Novel Approach for Surface Topography Simulation Considering the Elastic-Plastic Deformation of a Material During a High-precision Grinding Process

Chen

Jin

2022

Proceeding of 2021 International Conference on Wireless Communications, Networking and Applications

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A novel simulation approach for 3D surface topography that considers the elastic-plastic deformation of workpiece material during a high-precision grinding process is presented in this paper. First, according to the kinematics analysis for the abrasive grain during the grinding process, the motion trajectory of the abrasive grain can be calculated. Second, the kinematic interaction between the workpiece and the abrasive grains can be established, which integrates the elastic-plastic deformation effect on the workpiece material with the topography, the simulation results are more realistic, and the simulation precision is much higher. Finally, based on an improved surface applied to the grinding wheel, the surface topography of the workpiece is formed by continuously iterating overall motion trajectories from all active abrasive-grains in the process of high-precision grinding. Both the surface topography and the simulated roughness value of this work are found to agree well with those obtained in the experiment. Based on the novel simulation method in this paper, a brand-new approach to predict the quality of the grinding surface by providing machining parameters, selecting effective machining parameters, and further optimizing parameters for the actual plane grinding process, is provided.

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