2021
DOI: 10.1007/s10483-021-2708-9
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Torsional static and vibration analysis of functionally graded nanotube with bi-Helmholtz kernel based stress-driven nonlocal integral model

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Cited by 15 publications
(1 citation statement)
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“…Bo Zhang et al constructed a finite element model for standard PCBA boards assembled in three chip sizes, and verified the analysis results through modal tests [22]. It should be noted that the finite element model discussed in these studies is mainly a part of the entire system, while as a complex of many components, the characteristics of a system affect each other, and even the characteristics of the joint surface between components will be superimposed on the system characteristics [23][24][25][26]. Therefore, it is still a challenging task to analyze the vibration characteristics of chassis equipment at the system level.…”
Section: Literature Reviewmentioning
confidence: 99%
“…Bo Zhang et al constructed a finite element model for standard PCBA boards assembled in three chip sizes, and verified the analysis results through modal tests [22]. It should be noted that the finite element model discussed in these studies is mainly a part of the entire system, while as a complex of many components, the characteristics of a system affect each other, and even the characteristics of the joint surface between components will be superimposed on the system characteristics [23][24][25][26]. Therefore, it is still a challenging task to analyze the vibration characteristics of chassis equipment at the system level.…”
Section: Literature Reviewmentioning
confidence: 99%