Toughening of dicyandiamide-cured DGEBA-based epoxy resin using MBS core-shell rubber particles

Abstract

A diglycidyl ether bisphenol-A-based epoxy resin, cured using a dicyandiamide hardener, has been toughened by the addition of core-shell rubber particles, methyl methacrylate-butadiene styrene. Different amounts of core-shell particles (2.5, 3.75, and 5 wt%) were added to the epoxy resin and their effect on the fracture, mechanical-physical, and thermal properties of the epoxy resin was investigated. The fracture surfaces of the samples were studied using a scanning electron microscope. The results showed that increasing methyl methacrylate-butadiene-styrene particles in epoxy resin increased the fracture toughness (KIC) and fracture energy (GIC) of the modified epoxy resin compared with the unmodified epoxy resin. The tensile strength and Young’s modulus of the modified epoxy resin decreased slightly and the glass transition temperature, cure onset, peak and end temperatures remained approximately constant. Scanning electron microscope revealed that the unmodified epoxy resin fracture surface was smooth and brittle, but the modified epoxy resin showed significant plastic deformation.

Enhanced toughness and thermal conductivity for epoxy resin with a core–shell structured polyacrylic modifier and modified boron nitride

“…The particle size can be controlled as they are formed by emulsion polymerization before they are dispersed into the epoxy resin. [30][31][32][33][34] With the rapid development in electronic technology, demand for high performance and small size electronic devices has been on the rise. Such high demand causes these devices to generate and accumulate a great amount of heat that should be effectively dissipated to prolong the service life of the devices.…”

Influence of nanosilica and methyl methacrylate–butadiene–styrene core–shell rubber particles on the physical-mechanical properties and cure kinetics of diglycidyl ether of bisphenol-A-based epoxy resin

“…A clip-on extensometer was used to calculate the strain in the gauge length and also the Young's modulus based on the slope of the stress versus strain curve was measured in the range of 0.4% and 0.8% strain. 18…”

“…Adding of CTBN into EPs leads to much lower tensile strength, modulus and glass transition temperature (T g ). But, based on the research of Mousavi and Amraei, 18 by the CSR particles, these properties decreased slightly.…”

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

“…Epoxy composites have drawn a great deal of attention due to their excellent mechanical properties, high dielectric constant, high cohesiveness, good chemical stability, small shrinkage, and easy processing. That is why they have become an excellent option for widespread use in electrical and electronic applications 1–7 . However, when ultra‐high voltage direct current transmission is applied, conventional epoxy composites are not the best choice for electrical insulation applications because by incorporating microfillers, many defects will occur in the system 8 …”