Toughening the grain boundaries by introducing a small amount of the second phase: Ni-Cu-Mn-Ga shape memory alloys as an example

Meng, Jiaxi; Xie, Luyao; Yu, Qijia; Wang, Jingmin; Jiang, Chengbao

doi:10.1016/j.actamat.2023.119469

Acta Materialia

2024

DOI: 10.1016/j.actamat.2023.119469

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Toughening the grain boundaries by introducing a small amount of the second phase: Ni-Cu-Mn-Ga shape memory alloys as an example

Jiaxi Meng,

Luyao Xie,

Qijia Yu

et al.

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Cited by 11 publications

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Toughening the grain boundaries by introducing a small amount of the second phase: Ni-Cu-Mn-Ga shape memory alloys as an example

Cited by 11 publications

References 50 publications

Hydrostatic pressure-mediated grain boundary smoothing and plastic deformability in high-entropy alloys

Hydrostatic pressure-mediated grain boundary smoothing and plastic deformability in high-entropy alloys

Synergetic enhancement of ultimate strength and damping properties by pore structure in novel porous Cu-Al-Mn shape memory alloy

Temperature-dependent lattice dynamics study on phase stability, martensitic transformation mechanism, and vibrational entropy properties of B2-type Ni–Mn–Ti Heusler alloy

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