2024
DOI: 10.1021/acsapm.4c03158
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Toughness and Low Dielectric Cyanate Ester Resin Modified with Polyethersulfones Containing Fluorene and Allyl Units

Dan Zhao,
Jingwen Yao,
Dong Chen
et al.

Abstract: Cyanate resin is widely used in electronic packaging, printed circuit boards, radomes, and communication satellites for its excellent dielectric performance, heat resistance, and good flame retardancy, but its high brittleness is still a real challenge to be solved. In this paper, three poly(ether sulfone)s (PESs) were prepared from bis(4-fluorophenyl)sulfone with different bisphenol compounds, namely, bis(allyl)bisphenol A (DABPA, PES-a), bisphenol fluorene (BHF, PES-b), and the mixture of DABPA and BHF (PES-… Show more

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