Toward a more robust and accurate fast integral equation solver for microchip applications

Chew, W.C.; Jiang, Lijun; Chu, Yunhui; Wang, G.L.; Pan, Yulin

doi:10.1109/epep.2003.1250062

Cited by 8 publications

(2 citation statements)

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“…Therefore, matrix only needs to be filled for one layer. b) Matrices and are correlated (11) As a result, the need of evaluating and is eliminated and only needs to be evaluated. c) Matrix is equal to matrix in each layer (12) in which is the layer thickness.…”

Section: Reduction Of the 3-d Layered System Matrixmentioning

confidence: 99%

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

Jiao

Chakravarty

Dai

2007

IEEE Trans. Antennas Propagat.

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A high-capacity electromagnetic solution, layered finite element method, is proposed for high-frequency modeling of large-scale three-dimensional on-chip circuits. In this method, first, the matrix system of the original 3-D problem is reduced to that of 2-D layers. Second, the matrix system of 2-D layers is further reduced to that of a single layer. Third, an algorithm of logarithmic complexity is proposed to further speed up the analysis. In addition, an excitation and extraction technique is developed to limit the field unknowns needed for the final circuit extraction to a single layer only, as well as keep the right-hand side intact during the matrix reduction process. The entire procedure is numerically rigorous without making any theoretical approximation. The computational complexity only involves solving a single layer irrespective of the original problem size. Hence, the proposed method is equipped with a high capacity to solve large-scale IC problems. The proposed method was used to simulate a set of large-scale interconnect structures that were fabricated on a test chip using conventional Si processing techniques. Excellent agreement with the measured data has been observed from dc to 50 GHz.Index Terms-Electromagnetics, finite element method, high capacity, high frequency, on-chip circuits, three dimension.

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Section: Reduction Of the 3-d Layered System Matrixmentioning

confidence: 99%

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

Jiao

Chakravarty

Dai

2007

IEEE Trans. Antennas Propagat.

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“…Consequently, broadband fast solvers from the static range to the microwave range are needed. These solvers will capture the wave physics as well as the circuit physics inherent in the electrical design of computer chips [1]. Due to the increasing complexity of computer chip design, it is imperative that these fast solvers handle problems involving complicated geometries and various media.…”

Section: Introductionmentioning

confidence: 99%

A multilevel fast multipole algorithm for electrically small composite structures

Chu

Chew

2004

Micro & Optical Tech Letters

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Fast iterative solution algorithms for the frequency-domain layered finite-element based analysis of large-scale on-chip interconnect structures

Sheng

Jiao

2008

2008 IEEE-EPEP Electrical Performance of Electronic Packaging

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Toward a more robust and accurate fast integral equation solver for microchip applications

Cited by 8 publications

References 0 publications

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

A multilevel fast multipole algorithm for electrically small composite structures

Fast iterative solution algorithms for the frequency-domain layered finite-element based analysis of large-scale on-chip interconnect structures

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