Toward autonomous wearable triboelectric systems integrated on textiles

Gaubert, Valentin; Vauche, Gaëtan; Weimmerskirch-Aubatin, Jennifer; Corbier, Christophe; Boddaert, X.; Delattre, Roger; Djenizian, Thierry

doi:10.1016/j.isci.2022.105264

Cited by 4 publications

(2 citation statements)

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“…In standard transponder technology, which also applies to implementations on textile substrates, chips are affixed to the antenna terminals using methods like gluing [25], [26], soldering [27], or alternative bonding techniques [28]. The antenna itself is made of conductive materials on rigid [29], [30] or flexible [31], [32] substrates.…”

Section: A Transponder Technologymentioning

confidence: 99%

Identification Efficiency in RFIDtex Enabled Washing Machine

Jankowski-Mihułowicz,

Pawłowicz,

Kołcz

et al. 2023

IEEE Access

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The use of textronic RFID transponders (RFIDtex tags) offers completely new possibilities in designing household appliances. Their implementations in technologies of washing or ironing textiles are very promising. Specific information on maintaining clothes can be stored in the memory of RFIDtex tags that are permanently bound to the products. This information can be read by washing or ironing devices and then can be used to automatically select the best program or mode of machine operation. Since RFID technology is becoming more and more common, the solution seems simple and ordinary. Nevertheless, there are some barriers that prevent the popularization of such applications. Reliability and efficiency of identification are major concerns, especially near surrounding objects, such as other tags, material composition of textiles, and above all, metal drums of washing machines. The main purpose of the presented work is to propose the communication model in the anti-collision dynamic RFID system, dedicated to use in future intelligent industrial and home washing machines. To develop the elaborated idea, the washing machine demonstrator equipped with read/write RFID devices was designed. Moreover, the RFIDtex transponders according to the authors' conception (restricted under Polish patent, No. PAT.231291) are used in experimental stages. As part of the work, appropriate reading and scanning algorithms were developed to manage multiple data readings from tags inside the drum. Also, measurements were carried out to confirm the identification efficiency in such an Internet of Textile Things (IoTT) system basing on the RFIDtex tags that are placed inside the demonstration washing machine.

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Section: A Transponder Technologymentioning

confidence: 99%

Identification Efficiency in RFIDtex Enabled Washing Machine

Jankowski-Mihułowicz,

Pawłowicz,

Kołcz

et al. 2023

IEEE Access

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“…E-textiles enable a wide range of applications with respect to health monitoring (e.g., edema [4] or apnea [5] monitoring, hydration [6], and temperature measurement [7]), maintaining a comfortable temperature [8][9][10], measuring mechanical strain [11,12] integrating safety LED lighting [13], and facilitating wireless communication by means of textile antennas [14]. Conductive patterns and sensors on textile substrates can be created by typical textile fabrication technologies, such as weaving [15,16], knitting [17,18], or embroidering (Table 1) using microwires [19,20] or electrically conductive polymer yarns [21][22][23][24], by the deposition of conductive polymer pastes [25], or by a combination of the selective patterning of Ag NPs and electroless Cu-plating [26]. However, conventional semiconductor components or evaluation circuits either in SMD (surface-mounted device) packages or mounted on printed circuit boards (PCB) cannot easily be substituted by conductive or semiconductive yarns and have to be placed and electrically contacted on the textile substrates.…”

Section: Introductionmentioning

confidence: 99%

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

et al. 2023

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Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mΩ), linear voltage–current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared with the theoretical Holm’s model.

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