2003 Third IEEE Conference on Nanotechnology, 2003. IEEE-NANO 2003.
DOI: 10.1109/nano.2003.1231052
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Towards batch fabrication of bundled carbon nanotube thermal sensors

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Cited by 15 publications
(2 citation statements)
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“…We envision our sensors to eventually sense the input force by the change of conductivity due to mechanical bending of the embedded bundled carbon nanotubes, which are sandwiched by 2 layers of polymer (Parylene C) thin films. The fabrication process of our CNTembedded MEMS sensors were recently reported in [11] and [12].…”
Section: Introductionmentioning
confidence: 99%
“…We envision our sensors to eventually sense the input force by the change of conductivity due to mechanical bending of the embedded bundled carbon nanotubes, which are sandwiched by 2 layers of polymer (Parylene C) thin films. The fabrication process of our CNTembedded MEMS sensors were recently reported in [11] and [12].…”
Section: Introductionmentioning
confidence: 99%
“…Accordingly, AC electrophoresis makes the batch fabrication of nano devices using nanotubes as components feasible. We have proven that carbon nanotube devices built by this method are capable of performing very low power thermal sensing (i.e., ~1000 times lower than conventional MEMS polysilicon based thermal sensors) and can be fabricated in a relatively fast and efficient manner [5]. The detailed process to manipulate nanotubes using AC electrophoresis and the experimental results from using the carbon nanotube bundles as thermal sensing elements will first be presented.…”
Section: Introductionmentioning
confidence: 99%