Microbatteries (MBs) and microsupercapacitors (MSCs) are primary on‐chip micropower sources that drive autonomous and stand‐alone microelectronic devices for implementation of the Internet of Things (IoT). However, the performance of conventional MBs and MSCs is restricted by their 2D thin‐film electrode design, and these devices struggle to satisfy the increasing IoT energy demands for high energy density, high power density, and long lifespan. The energy densities of MBs and MSCs can be improved significantly through adoption of a 2D thick‐film electrode design; however, their power densities and lifespans deteriorate with increased electrode thickness. In contrast, 3D architecture electrodes offer remarkable opportunities to simultaneously improve MB and MSC energy density, power density, and lifespan. To date, various 3D architecture electrodes have been designed, fabricated, and investigated for MBs and MSCs. This review provides an update on the principal superiorities of 3D architecture electrodes over 2D thick‐film electrodes in the context of improved MB and MSC energy density, power density, and lifespan. In addition, the most recent and representative progress in 3D architecture electrode development for MBs and MSCs is highlighted. Finally, present challenges are discussed and key perspectives for future research in this field are outlined.