Towards rational design of low-temperature co-fired ceramic (LTCC) materials

Abstract

Abstract:High performance low temperature co-fired ceramic (LTCC) dielectrics is highly desired for next generation information technology. The rational design is a key issue for the development of new LTCC materials. In comparison to the design of conventional electroceramics, more attention should be paid on the formation process of the material structure for that of LTCC, in addition to the physical properties, due to the special requirement in fabrication processing. In this paper, sintering mechanism of three types of LTCC materials, i.e., glass-ceramics, glass ceramic composite, and glass bonded ceramics, as well as important factors of their dielectric properties are discussed and summarized, and the design strategies for LTCC dielectrics, based on new matrix materials with much lower sintering temperature or higher quality, are proposed. As an example for rational design, oxyfluoride glass-ceramic based dielectrics, a new class of LTCC materials with low ε r , is analyzed.

Overview on low temperature co-fired ceramic sensors

“…Hence, all laminated tapes have to be heated to softening point of organics and the tapes have to be pressed together applying either uniaxial or isostatic pressure. This process is typically carried out above ambient temperature in a range from 70 to 90 °C) at pressures from 2 to 30 MPa for a 3 to 10 min [11,83]. As it was shown in [84], the plastic model does not describe fully the bonding of LTCC.…”

“…The process consists of two main parts: debinding and sintering [11]. During debinding organic material is evaporated (e.g.…”

“…glass flow, reactions, crystallization etc. The mechanisms depend on the particular composition of the compound and are explained in detail in [11,99].…”

“…The inorganic fraction densifies due to several sintering mechanisms, which depend on the particular composition of the compound. These sintering mechanisms are explained in [11]. The LTCC technology enables the fabrication of multilayer structures having significantly higher thermal conductivity and better chemical and humidity resistance in comparison to Printed Circuit Boards (PCB).…”

Correlation Between Simulations and Real Measurements of Microstrip Filters Based on LTCC in High Frequency Area

“…Typical glass content of this GCC varies between 20% and 50% [3]. Microstrip structure is made by silver conductive paste with high electrical conductivity and typical sintering temperature below 900 °C.…”