2011 Sixteenth IEEE European Test Symposium 2011
DOI: 10.1109/ets.2011.51
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Towards Variation-Aware Test Methods

Abstract: Nanoelectronic circuits are increasingly affected by massive statistical process variations, leading to a paradigm shift in both design and test area. In circuit and system design, a broad class of methods for robustness like statistical design and self calibration has emerged and is increasingly used by the industry. The test community's answer to the massive-variation challenge is currently adaptive test. The test stimuli are modified on the fly (during test application) based on the circuit responses observ… Show more

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Cited by 10 publications
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“…The drawback of OBIST is, however, that the test circuitry is subject to the same process, supply voltage and temperature (PVT) variation as the CUT; a problem which has been discussed in the context of other RF BIST approaches [41]- [45], but has not received much attention in OBT and OBIST literature [45]. Adaptive test strategies may be used to dynamically alter test parameters based on wafer or die properties [46]- [50], including at RF [51], and should be considered in an OBT test threshold selection evaluation. Temperature-aware adaptive testing has also been shown to improve test efficacy [49], [52], especially when combined in full PVT awareness [53] but has not been explored in an OBT or OBIST context for RFCMOS.…”
Section: Introductionmentioning
confidence: 99%
“…The drawback of OBIST is, however, that the test circuitry is subject to the same process, supply voltage and temperature (PVT) variation as the CUT; a problem which has been discussed in the context of other RF BIST approaches [41]- [45], but has not received much attention in OBT and OBIST literature [45]. Adaptive test strategies may be used to dynamically alter test parameters based on wafer or die properties [46]- [50], including at RF [51], and should be considered in an OBT test threshold selection evaluation. Temperature-aware adaptive testing has also been shown to improve test efficacy [49], [52], especially when combined in full PVT awareness [53] but has not been explored in an OBT or OBIST context for RFCMOS.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, the presence of small delays will cause the chips easier to aging and can be taken as an indication of early life failures [2,3]. Therefore, small delay defect (SDD) screening becomes increasingly important in IC test [4][5][6] or diagnosis [7,8].…”
Section: Introductionmentioning
confidence: 99%