“…We expect this trend to further intensify for the complex and diverse 3D integration landscape, thereby increasing the risk exposure for 3D chips. To address and manage this challenge of verification and other security-centric challenges, the notions of "secure by design" and "design-for-trust" have been promoted for some years now for "regular" 2D chips [116], [117], [118], [119], [123], [124], [125], [126], [127], [128]. Similar studies are recently focusing on 3D chips as well [129], [130], [131], [132], [133], [134], [135], [136], [137], [138].…”