Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process

Lee, Changhyun; Park, Jonghoon; Yoo, Jinho; Cho, Hyungjun; Choi, Jungi; Cho, Jeongho; Park, Changkun

doi:10.1016/j.mejo.2013.07.006

Cited by 7 publications

(9 citation statements)

References 14 publications

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“…Three dimensional integrated circuits constructed using this approach are widely reported [4]- [6], however only provide a contactless interface for data delivery between tiers. Because of this, 3D-ICs using ICLs often achieve power delivery through other separate means, the most common being wire-bonding.…”

Section: Concurrent Vertical Data and Powermentioning

confidence: 99%

CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs

Fletcher

Das

Mak

2019

2019 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Three dimensional system integration is a promising enabling technology for realising heterogeneous ICs, facilitating stacking of disparate elements such as MEMS, sensors, analogue components, memories and digital processing. Recently, research has looked to contactless 3D integration using inductive coupling links (ICLs) to provide a low-cost alternative to conventional contact-based approaches (e.g. through silicon vias) for 3D integration. In this paper, we present a novel, fully wireless, ICL architecture for Concurrent Data and Power Transfer (CoDAPT) between tiers of a 3D-IC. The proposed CoDAPT architecture uses only a single inductor for simultaneous power transmission and data communication, resulting in high area efficiency, whilst facilitating low-cost, straightforward die stacking. The proposed design is experimentally validated through full wave EM and SPICE simulation and demonstrates capability to communicate data vertically at a rate of 1.3Gbps/channel (utilising an area of only 0.052mm 2) whilst simultaneously achieving power delivery of 0.83mW, under standard operating conditions. A case study is also presented, demonstrating that CoDAPT achieves an area reduction greater than 1.7× when compared with existing works, representing an important progression towards ultra low-cost 3D-ICs through fully wireless stacking.

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Section: Concurrent Vertical Data and Powermentioning

confidence: 99%

CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs

Fletcher

Das

Mak

2019

2019 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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“…The feasibility of wireless chip-to-chip communication (WCC) to overcome the drawbacks of TSV technology has already been proven through various previous studies [8][9][10][11][12][13][14][15]. To enhance the overall yields of 3DICs, the usage of through via holes should be minimized by utilizing WCC technology.…”

Section: Introductionmentioning

confidence: 99%

“…Accordingly, the usage of through via holes can be minimized compared to typical 3DICs, which utilize TSV technology only. Figure 5 illustrates the conceptual building blocks used in a previous study [8]. As shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the transceiver is a pulse-type WCC transceiver. In fact, the pulse-type transceiver is designed to support WCC technology with minimal alterations to an existing digital transmitter that supports the wired communication [8]. The reason for this design strategy is to support wireless and wired communication simultaneously with a single transmitter structure.…”

Section: Introductionmentioning

confidence: 99%

“…Accordingly, the pulse-type transceiver lacks sufficient optimization for WCC technology. Although a previous study on the transceiver architecture [8] verified the feasibility for WCC, there are some problems associated with the pulse-type input voltage waveform in the receiver coil. Given that the magnitude and width of a received pulse in the receiver coil are dependent on the slew-rate of the digital voltage waveform in the transmitter coil, the slew-rate should be carefully controlled in the transmitter.…”

Section: Introductionmentioning

confidence: 99%

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An Rf Transceiver for Wireless Chip-to-Chip Communication Using a Cross-Coupled Oscillator

Shin¹,

Lee²,

Lee³

et al. 2019

PIER C

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In this study, we propose a transceiver architecture for wireless chip-to-chip communication using on/off keying (OOK) modulation. The proposed transceiver is composed of an oscillator, coils, an envelope detector, and a Schmitt trigger. Given that the oscillator itself acts as an OOK modulator, the transmitter is simplified. Additionally, because the oscillating signal is coupled with the transmitter and receiver coils, the chip-to-chip communication reliability is improved compared to a pulse-type transceiver. To verify the feasibility of the proposed transceiver, we design a transceiver using a 180-nm complementary metal-oxide-semiconductor process. For a design with a 1.5-GHz oscillation frequency and 1-MHz digital input signal, we verify that the proposed transceiver successfully recovers the original digital signal.

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