2022
DOI: 10.1039/d2nr04283e
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Transfer printing technologies for soft electronics

Abstract: Soft electronics have received increasing attention in recent years, owing to their wide-ranging applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer...

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Cited by 12 publications
(5 citation statements)
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“…These properties are difficult to alter during the transfer printing process. [49,72] Therefore, the critical point of the transfer printing process is to regulate the stamp/ink interface adhesion strength to switch between strong and weak states.…”
Section: Fundamental Features Of Transfer Printing Systemsmentioning
confidence: 99%
“…These properties are difficult to alter during the transfer printing process. [49,72] Therefore, the critical point of the transfer printing process is to regulate the stamp/ink interface adhesion strength to switch between strong and weak states.…”
Section: Fundamental Features Of Transfer Printing Systemsmentioning
confidence: 99%
“…Successful transfer also relies on the viscoelasticity of the stamp and the peeling rate. 68,285 PDMS has been utilized to pick up devices from silicon wafers and transfer them to the skin. 29 However, elastomer-based transfer printing faces challenges with largearea e-tattoos due to the nondevelopable shape of human skin.…”
Section: Transfer Printingmentioning
confidence: 99%
“…To transfer e-tattoos to the skin, the adhesion force between the stamp and the e-tattoos must be stronger than that between the device and the handling substrate but weaker than that between the device and the skin. Successful transfer also relies on the viscoelasticity of the stamp and the peeling rate. , PDMS has been utilized to pick up devices from silicon wafers and transfer them to the skin . However, elastomer-based transfer printing faces challenges with large-area e-tattoos due to the nondevelopable shape of human skin .…”
Section: Materials Design Manufacture and Transferring Technologies O...mentioning
confidence: 99%
“…[ 169 ] The engineering route for pre‐strained techniques typically starts with the fabrication of functional devices on a rigid substrate, followed by a stamping step to transfer the device from the rigid substrate to the pre‐strained soft substrate. [ 172 ] The film will finally undergo out‐of‐plane deformations upon stress release. Harnessed by Chang et al., [ 93 ] a crumple‐wrinkle film architecture with high strain‐insensitive stretchability was realized (Figure 11b).…”
Section: Fabrication Technologies For Integrated Sensorsmentioning
confidence: 99%