2024
DOI: 10.4071/001c.115497
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Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding

Pingping Ye,
Jianwen Han,
Stephan Braye
et al.

Abstract: We discuss two electrochemical plating approaches for nanotwinned copper (ECP nt-Cu)—Gen 1 and Gen 2. These two approaches allow control over columnar width and transition layer thickness on Cu substrates, enabling the filling of nanotwinned Cu for bonding applications. Both approaches produce stable nt-Cu structures with minimal transition layers when electroplated on (111) Cu substrate. However, grain size, transition layer thickness on polycrystalline substrates, and feature-filling behavior differ. The res… Show more

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