Transient 3-D thermal analysis for an air-cooled induction motor

Abstract

-For an induction motor that is cooled by an airflow ventilated across the air gap between the rotor and stator, the rotor endring and stator end-turn cooling might influence the motor temperatures in the core sections appreciably. Detailed motor thermal modeling is typically required to provide transient rotor temperature distributions for rotor structural analysis and to predict stator temperature distributions to assure the maximum stator temperature is below the stator insulation temperature limit.For an air-cooled induction motor, transient 3-D finite element thermal analyses for both rotor and stator have been performed in this paper. In the stator thermal model, the slot conductors and various insulations were smeared and equivalent thermal properties were used to reduce modeling and computational effort. Position-dependent and time-dependent air cooling boundary conditions, which include air temperatures and forced convection heat-transfer coefficients, were applied to the 3-D thermal models.

Computer modelling of 3D transient thermal field coupled with electromagnetic field in three‐phase induction motor on load

“…This is practically an alternative since the 3D‐FEM applied to time‐dependent problems are less and less expensive both in software and hardware implementation. There are some proposals using 3D‐FEM in transient thermal analysis (Liu et al , 2005), but one of the outstanding of 3D‐FEM models was recently proposed by the authors for transient thermal field coupled with electromagnetic field for one‐phase IM (Komęza et al , 2005). Anyway, always it will be necessary to validate the simulated results with measurements in both, stator and rotor at run operation.…”

Study of heat dissipation for HXD2 locomotive's auxiliary converter

“…INTRODUCTION Applications demanding high-power conversion such as voltage converter module for electric traction and drives, power sources, automotive electronics and telecommunications, have introduced a trend for achieving higher power densities at lower cost [1] [2]. The performance and characteristics of semiconductor devices can be considerably affected by temperature variations, and for this reason the static and dynamic effects induced by the heat dissipation in the system must be taken into account.…”