Transient Analysis of Uniform Resistive Transmission Lines in a Homogeneous Medium

Gruodis, A. J.

doi:10.1147/rd.236.0675

Cited by 65 publications

(9 citation statements)

References 5 publications

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“…Figure 9 shows that the ASTAP simulation results [5] agree very well with the approximate solution in Table 2 in the time duration specified. In the following discussions, we shall neglect the second order terms associated with T, for the far-end voltage at t = 1, 2 and 37d shown in Table 2.…”

Section: = -2vo(h'/ts)f(tst)exp[-(t-~d)/t1 -~Vo(~'/ta)f(ta/t)~xp[supporting

confidence: 58%

Resistive signal line wiring net designs in multichip modules

Chang¹

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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To approximate the frequency dependence of the characteristic impedance and signal attenuation of a DC resistive transmission line, we propose formulas with one pole and one zero on the negative real axis. W e then derive the algebraic time-domain solutions for the near-end and far-end voltages of this line, which is driven by a constant resistance source. either open circuited or terminated by a constant resistance load. Nomographs to guide the MCM wiring net designs are also developed and presented.The far-end of this line is

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Section: = -2vo(h'/ts)f(tst)exp[-(t-~d)/t1 -~Vo(~'/ta)f(ta/t)~xp[supporting

confidence: 58%

Resistive signal line wiring net designs in multichip modules

Chang¹

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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“…The interconnection lines are fully described by their distributed, frequency dependent transmission line parameters. The network is solved using the modified nodal analysis approach [14]. The coupled transmission lines are completely modeled in the frequency domain, using their frequency dependent distributed line parameters.…”

Section: Electrical Modeling Of MCM Interconnectionsmentioning

confidence: 99%

Performance analysis of MCM systems

Truzzi

Beyne

Ringoot

1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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When a new interconnection technology is developed, it is of interest to accurately characterize its electrical features from a system's perspective and evaluate its possible application areas and boundary limits. Accurate design models can then be extracted and used for a correct design and implementation of electronic systems.This paper describes a case study used to characterize a fivelayer thin-film multichip module (MCM) technology developed for high speed digital applications. The high frequency characterization of the substrate has been combined with the electrical models of the input/output ( I/O) buffers of a complementary metal-oxide-semiconductor (CMOS) technology to accurately analyze the signal propagation with a network simulation tool. A test chip and MCM module have been developed to evaluate how the maximum system frequency is influenced by different quantities such as line length, type of driver or noise. Experimental results, showing a good match with simulations, demonstrate the effectiveness of this approach.It is also shown how it is possible to take advantage of some apparently limiting features of thin-film MCM's to actually improve the system performance.

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“…In today's integrated circuit, since on-chip global interconnect lines and package interconnect lines become the significant portion of the harmonic wave length of the operating frequency, they have to be treated as a transmission line which is modeled as segmented constant RLC lumped circuits [3] [4]. However, the transmission line parameters of the interconnect lines are inherently frequency-dependent due to skin effect, proximity effect, induced eddy current, and conductive substrate effect [5].…”

Section: Introductionmentioning

confidence: 99%

High-Frequency-Measurement-Based Frequency-Variant Transmission Line Characterization and Circuit Modeling for Accurate Signal Integrity Verification

Kim

2007

8th International Symposium on Quality Electronic Design (ISQED'07)

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Novel experimental characterization method and circuit modeling for frequency-variant transmission lines are presented. Experimental test patterns are designed and fabricated by using a BGA package process. They are characterized and modeled by using time-domain TDR/TDT wave measurements and frequency-domain sparameter measurements. Then taking the frequencyvariant effects into account, a transmission line circuit model is developed, followed by the s-parameter-based model verification. Thereby, it is shown that the conventional constant-model-parameter-based circuit model may not be accurate enough to verify the signal integrity of high-performance integrated circuits.

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Transient Analysis of Uniform Resistive Transmission Lines in a Homogeneous Medium

Cited by 65 publications

References 5 publications

Resistive signal line wiring net designs in multichip modules

Resistive signal line wiring net designs in multichip modules

Performance analysis of MCM systems

High-Frequency-Measurement-Based Frequency-Variant Transmission Line Characterization and Circuit Modeling for Accurate Signal Integrity Verification

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