2013
DOI: 10.1016/j.microrel.2013.07.108
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Transient device simulation of neutron-induced failure in IGBT: A first step for developing a compact predictive model

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Cited by 13 publications
(2 citation statements)
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“…Therefore, quite early, device simulators have been put to use to model charge multiplication following the introduction of burst of charge into MOSFETs [29] and IGBTs [30][31][32]. Many of these models defined the occurrence of device failure as the triggering of device-internal bipolar transistors and latches.…”
Section: Device Simulation Of Charge Multiplicationmentioning
confidence: 99%
“…Therefore, quite early, device simulators have been put to use to model charge multiplication following the introduction of burst of charge into MOSFETs [29] and IGBTs [30][31][32]. Many of these models defined the occurrence of device failure as the triggering of device-internal bipolar transistors and latches.…”
Section: Device Simulation Of Charge Multiplicationmentioning
confidence: 99%
“…Then two types of numerical tools are used to simulate the crossing of an ionizing particle in a device, each of them corresponding to a scale of the circuit The first one, the TCAD simulation (as Sentaurus [1]), relies on a quantitative multi physics approach, at the scale of the lowest length in the electronic device. The particle is generated as an electron-hole distribution in the device simulated at a physical level and the transient current is generated at the electrodes by solving the transport equation in the semi-conductor volume [2,3,4]. If well calibrated, TCAD simulation is a realistic method for single events studies but it is time consuming, and generally needs high CPU resources because based on a multi-physics finite elements approach.…”
Section: Introductionmentioning
confidence: 99%