Transient liquid phase bonding of steel using an Fe–B interlayer

Luozzo, Nicolás Di; Fontana, M.; Arcondo, B.

doi:10.1007/s10853-006-0190-9

Cited by 17 publications

(10 citation statements)

References 14 publications

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“…The bonding process is usually confined in a vacuum [3-5, 7, 12, 14-17, 20-30, 35, 38-40, 46-58, 61-63, 65, 66, 68-72, 76-83, 86-88, 93-100, 103-105, 108, 110, 112-115, 117, 119, 122-127, 130, 132-138, 140-157], although an inert atmosphere, such as argon, can be used [6,11,14,32,33,43,45,60,67,74,75,90,111,121,134,158,159]. On rare occasions, TLP bonding is performed under a different atmosphere, such as nitrogen [44], hydrogen [160], nitrogen and hydrogen [18], or open air [129].…”

Section: Tlp Bonding Processmentioning

confidence: 99%

“…• Heating to the bonding temperature, CP1-5a: less than a minute to about an hour; dependent on the method of heating, the heating rate of the heating apparatus, and the substrate material's thermal properties • Melting of the interlayer, CP3: less than a second [121,124,138] to several seconds [19,43,77] • Melting back of the substrate, CP3-5a: seconds [11,71,73,77,124,138,161,174] to minutes [7,36,37,43,71,73,85,121] • Isothermal solidification, CP5a-5c: minutes [7,25,36,37,56,74,77,95,96,105,121,125,153] to hours [7,11,33,36,37,43,57,58,105,146,157,175], although it can occur in less than a minute …”

Section: Time Frame Of Tlp Bondingmentioning

confidence: 99%

“…Specific applications are the repair of Nibased superalloy turbine blade components [7,9,39,74,104,105,135,142] and the joining of heat-resistant alloys that are inherently susceptible to hot cracking or post-weld heat treatment cracking [5,11,20,38,59,78,80,135,136,140,173]. Table 3 presents a spectrum of TLP bonds as of now, including bonds of dissimilar materials.…”

Section: Applications Of Tlp Bondingmentioning

confidence: 99%

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Overview of transient liquid phase and partial transient liquid phase bonding

2011

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Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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Section: Tlp Bonding Processmentioning

confidence: 99%

Section: Time Frame Of Tlp Bondingmentioning

confidence: 99%

Section: Applications Of Tlp Bondingmentioning

confidence: 99%

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Overview of transient liquid phase and partial transient liquid phase bonding

2011

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“…In addition, amorphous layers improve the contact with the tubes when pressure is applied, whereas crystalline layers break. From previous works [5,8], we know that for low carbon steel tubes, Fe 96.2 B 3.8 wt.% amorphous foils of 20 μm thickness as filler material, an applied pressure of 4 MPa and a holding time of 7 min at T P ≈ 1, 250 • C, the solidification process was completed. From now on, this pressure and thermal cycle are referred as standard procedures.…”

Section: Physical Description-transient Liquid Phase Bonding (Tlpb)-bmentioning

confidence: 99%

Mössbauer characterization of joints of steel pieces in transient liquid phase bonding experiences

et al. 2011

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Joining of seamless, low carbon, steel tubes were performed by means of Transient Liquid Phase Bonding process employing a foil of Fe-Si-B metallic glass as filler material. The influence of the main parameters of the process was evaluated: temperature, holding time, pressure and post weld heat treatment. Powder samples were obtained from the joint of tubes and characterized employing Mössbauer Spectroscopy in transmission geometry. The sampling was performed both in tubes successfully welded and in those which show joint defects. The results obtained are correlated with the obtained microstructure and the diffusion of Si and B during the process.

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“…[32] Nishimoto et al [32] reported that K is 0.09, 0.80, and 6.75 at 1373. 15 [25,[28][29][30] is one third of that in Ni (0.3 at. pct).…”

Section: B No Bn Precipitates In the Bonding-affected Zonementioning

confidence: 99%

Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Yuan

Kim

Kang

2010

Metall Mater Trans A

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Microstructural evolution and bonding behavior of transient liquid-phase (TLP) bonded joint for a duplex stainless steel using MBF-30 (Ni-4.5Si-3.2B [wt pct]) and MBF-50 (Ni-7.5Si-1.4B-18.5Cr [wt pct]) were investigated. Using MBF-30, the microstructure of the athermally solidified zone was dependent on B diffusion at 1333.15 K (1060°C). Ni 3 B and a supersaturated c-Ni phase were observed in this zone. BN appeared in the bonding-affected zone. However, using MBF-50, the influences of base metal alloying elements, particularly N and Cr as well as Si in the filler material, on the bond microstructure development were more pronounced at 1448.15 K (1175°C). BN and (Cr, Ni) 3 Si phase were present in the bond centerline. The formation of BN precipitates in the bonding-affected zone was suppressed. A significant deviation in the isothermal solidification rate from the conventional TLP bonding diffusion models was observed in the joints prepared at 1448.15 K (1175°C) using MBF-50.

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Transient liquid phase bonding of steel using an Fe–B interlayer

Cited by 17 publications

References 14 publications

Overview of transient liquid phase and partial transient liquid phase bonding

Overview of transient liquid phase and partial transient liquid phase bonding

Mössbauer characterization of joints of steel pieces in transient liquid phase bonding experiences

Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

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