Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Pahinkar, Darshan G.; Puckett, Waylon; Graham, Samuel; Boteler, Lauren; Ibitayo, Dimeji; Narumanchi, Sreekant; Paret, Paul; DeVoto, Douglas; Major, Joshua

doi:10.1002/adem.201800039

Cited by 20 publications

(6 citation statements)

References 8 publications

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“…For instance, a local hot spot can be effectively cooled by using localized jet cooling. This study provides an insight into how much these three geometries can be effective in cooling the new AlN-AlSiC design being investigated by the authors [7].…”

Section: Resultsmentioning

confidence: 99%

“…In this new design, an AlN dielectric substrate is directly bonded to an AlSiC baseplate/heat sink that has a similar CTE, as shown in Fig. 1(b) using a transient liquid phase (TLP) bonding approach [7]. The minimization of the CTE mismatch between the two layers results in a lower probability of fatigue and aging failures.…”

Section: Introductionmentioning

confidence: 99%

“…The details of this TLP bonding process as well as the thermal, mechanical, and metallographic characterization of the bond material are reported elsewhere [7]. The thermal conductivity of the bond material was found to be 12066 W m À1 K À1 (more than twice that of the typical solder materials), whereas its Young's modulus and hardness values were 84 GPa and 6.3 GPa, respectively (Young's modulus for AuSn solder is 59 GPa) [11].…”

Section: Introductionmentioning

confidence: 99%

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Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Pahinkar

Boteler

Ibitayo

et al. 2019

Journal of Electronic Packaging

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With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC)—Cu base plate—Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single-phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, microchannels, pin fins, and jets can be designed to yield a heat transfer coefficients (HTCs) of up to 65,000 W m−2 K−1, which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Pahinkar

Boteler

Ibitayo

et al. 2019

Journal of Electronic Packaging

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“…Leveraging process innovations, 42 it is conceivable that fabrication steps may be reduced to the processing of a single wafter for the all-Si EHF μ-Cooler configuration which would positively reduce costs associated with material and labor. Beyond such improvements, and building off this TEA, EHF μ-Cooler configurations built from other substrate systems, such as DBC substrates, 20 aluminum (Al), or AlSiC metal matrix composites, 56 might also be considered as part of next-step cost/weight reduction or performance metric improvement efforts. For example, the use of a DBC substrate may offset a significant portion of the most expensive (i.e., Si microfabrication) steps of the current EHF μ-Cooler fabrication schemes.…”

Section: Discussionmentioning

confidence: 99%

Techno-economic feasibility analysis of an extreme heat flux micro-cooler

Dede¹,

Zhang

et al. 2023

iScience

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“…Packaging the power devices requires attachment to a substrate and electrical interconnection to the circuit tracing. The major attachment technologies include solders [27], silver-sintering [28], and transient liquid-phase bonding (TLPB) [29], [30]. Properties to consider during material selection include the melting temperature, thermal conductivity, as well as the CTE since this will affect performance degradation during thermal cycling.…”

Section: B Die Attachment and Interconnectionmentioning

confidence: 99%

Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Cited by 20 publications

References 8 publications

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Techno-economic feasibility analysis of an extreme heat flux micro-cooler

Automotive Power Module Packaging: Current Status and Future Trends

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