“…The research proposed here is a novel multi-scale lattice structure manufacturing platform that will utilize the dip-coating science for delivering the interlayer particles in hard to reach places and liquid-bridge the gap for TLP bonding. Since its invention in the early 1970s, much work has been performed on optimizing TLP bonding parameters, a list that includes temperature, holding time 74 , pressure, base materials 75 , interlayer composition 76,77 , MPD types, diffusion rate 78 , and microstructure development 79,80 . However, faying surfaces are commonly assumed to be semi-infinite flat substrates and the interlayer material is generally applied in the form of thin foil [81][82][83] , fine powder (with or without binder) 84,85 , paste 86 , electroplate 87,88 and, sputter 89,90 .…”