“…The bonding process is usually confined in a vacuum [3-5, 7, 12, 14-17, 20-30, 35, 38-40, 46-58, 61-63, 65, 66, 68-72, 76-83, 86-88, 93-100, 103-105, 108, 110, 112-115, 117, 119, 122-127, 130, 132-138, 140-157], although an inert atmosphere, such as argon, can be used [6,11,14,32,33,43,45,60,67,74,75,90,111,121,134,158,159]. On rare occasions, TLP bonding is performed under a different atmosphere, such as nitrogen [44], hydrogen [160], nitrogen and hydrogen [18], or open air [129].…”